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• Supply Voltage Range from 2.0V to 5.5V
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• ± 8 mA Output Drive at 5.0V
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• CMOS low power consumption
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• Schmitt Trigger Action at All Inputs Make the Circuit Tolerant for Slower Input Rise and Fall Time.
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• Latch-Up Exceeds 100mA per JESD 78, Class II
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• SOT25 and SOT353: Assembled with “Green” Molding Compound (no Br, Sb)
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• Lead Free Finish / RoHS Compliant (Note 1)
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| CATALOG |
74AHC1G08W5-7 PARAMETRIC INFO
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74AHC1G08W5-7 PACKAGE INFO
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74AHC1G08W5-7 MANUFACTURING INFO
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74AHC1G08W5-7 PACKAGING INFO
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74AHC1G08W5-7 ECAD MODELS
|
74AHC1G08W5-7 APPLICATIONS
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|
PARAMETRIC INFO
|
| Logic Family |
AHC |
| Logic Function |
AND |
| Number of Element Inputs |
2-IN |
| Number of Element Outputs |
1 |
| Number of Elements per Chip |
1 |
| Number of Output Enables per Element |
0 |
| Number of Selection Inputs per Element |
0 |
| Output Type |
Push-Pull |
| Input Type |
Schmitt Trigger |
| Minimum Operating Supply Voltage (V) |
2 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Typical Operating Supply Voltage (V) |
2.5|3.3|5 |
| Maximum High Level Output Current (mA) |
-8 |
| Maximum Low Level Output Current (mA) |
8 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Maximum Propagation Delay Time @ Maximum CL (ns) |
12.3@3.3V|7.9@5V |
| Absolute Propagation Delay Time (ns) |
16 |
| Propagation Delay Test Condition (pF) |
50 |
| Maximum Quiescent Current (uA) |
1 |
|
|
PACKAGE INFO
|
| Supplier Package |
SOT-25 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
5 |
| Lead Shape |
Gull-wing |
| PCB |
5 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.95 |
| Package Length (mm) |
3 |
| Package Width (mm) |
1.6 |
| Package Height (mm) |
1.1 |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1.15 |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
MO-178AA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
|
|
PACKAGING INFO
|
| Packaging Suffix |
7 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Packaging Document |
Link to Datasheet |
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|
| ECAD MODELS |
 |
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| APPLICATIONS |
| • General Purpose Logic |
• Wide array of products such as:
o PCs, networking, notebooks, netbooks, PDAs
o Computer peripherals, hard drives, CD/DVD ROM
o TV, DVD, DVR, set top box
o Personal Navigation / GPS
o MP3 players ,Cameras, Video Recorders |
| |
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