|
|
• Low input voltage noise: 1.2 nV/√Hz
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• Low common-mode output: 0.9 V on single supply
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• 0.5 mV typical offset voltage
|
• Externally adjustable gain
|
• Adjustable output common-mode voltage
|
|
| CATALOG |
ADA4930-2YCPZ-R2 COUNTRY OF ORIGIN
|
ADA4930-2YCPZ-R2 PARAMETRIC INFO
|
ADA4930-2YCPZ-R2 PACKAGE INFO
|
ADA4930-2YCPZ-R2 MANUFACTURING INFO
|
ADA4930-2YCPZ-R2 PACKAGING INFO
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ADA4930-2YCPZ-R2 ECAD MODELS
|
ADA4930-2YCPZ-R2 APPLICATIONS
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|
COUNTRY OF ORIGIN
|
Korea (Republic of)
|
|
PARAMETRIC INFO
|
| Type |
Differential Amplifier |
| Number of Elements per Chip |
2 |
| Number of Channels per Chip |
2 |
| Minimum PSRR (dB) |
71(Max) |
| Output Type |
Differential |
| Maximum Input Offset Voltage (mV) |
3.1@5V |
| Maximum Input Bias Current (uA) |
34(Min)@5V |
| Minimum CMRR (dB) |
77(Max) |
| Minimum CMRR Range (dB) |
75 to 85 |
| Output Logic Level |
CML |
| Maximum Quiescent Current (mA) |
76.8@5V |
| Process Technology |
<2.5um |
| Typical Output Current (mA) |
30@5V |
| Maximum Input Resistance (MOhm) |
3(Typ)@5V |
| Maximum Voltage Gain Range (dB) |
60 to 75 |
| Typical Slew Rate (V/us) |
3400@5V |
| Typical Input Offset Current (uA) |
0.1@5V |
| Maximum Input Offset Current (uA) |
0.82@5V |
| Maximum Voltage Gain (dB) |
64(Typ) |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
105 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
125 |
| Power Supply Type |
Single |
| Maximum Supply Voltage Range (V) |
5 to 7 |
| Typical Single Supply Voltage (V) |
3.3|5 |
| Maximum Single Supply Voltage (V) |
5.5 |
| Maximum Operating Supply Voltage (V) |
5.5 |
|
|
PACKAGE INFO
|
| Supplier Package |
LFCSP EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
24 |
| Lead Shape |
No Lead |
| PCB |
24 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
4 |
| Package Width (mm) |
4 |
| Package Height (mm) |
0.73 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
4 |
| Package Overall Width (mm) |
4 |
| Package Overall Height (mm) |
0.75 |
| Seated Plane Height (mm) |
0.75 |
| Mounting |
Surface Mount |
| Terminal Width (mm) |
0.25 |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Lead Frame Chip Scale Package, Exposed Pad |
| Package Family Name |
CSP |
| Jedec |
MO-220WGGD-8 |
| Package Outline |
Link to Datasheet |
| Maximum PACKAGE_DIMENSION_L (mm) |
4.1 |
| Minimum PACKAGE_DIMENSION_L (mm) |
3.9 |
| Maximum PACKAGE_DIMENSION_W (mm) |
4.1 |
| Minimum PACKAGE_DIMENSION_W (mm) |
3.9 |
| Maximum Diameter (mm) |
N/R |
| Minimum Diameter (mm) |
N/R |
| Minimum Seated_Plane_Height (mm) |
0.7 |
| Minimum PACKAGE_DIMENSION_H (mm) |
N/A |
| Maximum PACKAGE_DIMENSION_H (mm) |
0.75 |
| Maximum Seated_Plane_Height (mm) |
0.8 |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R2 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
250 |
| Reel Diameter (in) |
13 |
| Packaging Document |
Link to Datasheet |
|
| |
| ECAD MODELS |
 |
|
| APPLICATIONS |
| • ADC drivers |
| • Single-ended-to-differential converters |
| • IF and baseband gain blocks |
| • Differential buffers |
| • Line drivers |
| |
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