ADRF5020BCCZN-R7 Analog Devices HIGH ISOLATION SPDT, 30GHZ, FAST

2026/02/3 21

CATALOG

Korea (Republic of)

Switch Type	SPDT
Number of Switches	1
Switch Configuration	Single SPDT
Frequency Band (MHz)	100 to 30000
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	85
Process Technology	0.18um
Maximum Insertion Loss (dB)	2(Typ)
Typical Operating Supply Voltage (V)	-2.5\|3.3
Maximum Frequency (MHz)	30000
Technology	Silicon
Switching Speed (ns)	0.00001(Typ)
Minimum Operating Supply Voltage (V)	-2.75\|3
Maximum Input Power	24dBm
Maximum Operating Supply Voltage (V)	-2.25\|5.4
High Control Voltage (V)	1.7 to 5
Minimum Isolation Voltage (dB)	60(Typ)
Typical Supply Current (mA)	-0.001\|0.1
Typical Input 1dB Compressed Power (dBm)	28
Minimum Storage Temperature (°C)	-65
Maximum Storage Temperature (°C)	150

Supplier Package	LGA EP
Basic Package Type	Non-Lead-Frame SMT
Pin Count	20
Lead Shape	No Lead
PCB	20
Tab	N/R
Pin Pitch (mm)	0.4
Package Length (mm)	3
Package Width (mm)	3
Package Height (mm)	0.73
Package Diameter (mm)	N/R
Package Overall Length (mm)	3
Package Overall Width (mm)	3
Package Overall Height (mm)	0.73
Seated Plane Height (mm)	0.73
Mounting	Surface Mount
Terminal Width (mm)	0.2
Package Weight (g)	N/A
Package Material	Plastic
Package Description	Land Grid Array Package, Exposed Pad
Package Family Name	LGA
Jedec	N/A
Package Outline	Link to Datasheet

MSL	3
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	30
Number of Reflow Cycle	3
Standard	J-STD-020D
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Lead Finish(Plating)	Au
Under Plating Material	Pd over Ni
Number of Wave Cycles	N/R

• Test instrumentation

• Microwave radios and very small aperture terminals (VSATs)

• Military radios, radars, electronic counter measures (ECMs)

• Broadband telecommunications systems