|
|
• Plastic SMD package
|
• Low-leakage current: typ. 3 pA
|
• Switching time: typ. 0.8 us
|
• Continuous reverse voltage: max. 75 V
|
• Repetitive peak reverse voltage: max. 85 V
|
• Repetitive peak forward current: max. 500 mA
|
|
| CATALOG |
BAS416,115 COUNTRY OF ORIGIN
|
BAS416,115 PARAMETRIC INFO
|
BAS416,115 PACKAGE INFO
|
BAS416,115 MANUFACTURING INFO
|
BAS416,115 PACKAGING INFO
|
BAS416,115 APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
China
|
|
PARAMETRIC INFO
|
| Type |
Switching Diode |
| Configuration |
Single |
| Maximum DC Reverse Voltage (V) |
75 |
| Peak Reverse Repetitive Voltage (V) |
85 |
| Maximum Continuous Forward Current (A) |
0.2 |
| Maximum Power Dissipation (mW) |
250 |
| Repetitive Peak Forward Current (A) |
0.5 |
| Speed |
Standard Recovery Rectifier |
| Maximum Junction Ambient Thermal Resistance (°C/W) |
450 |
| Maximum Forward Voltage (V) |
1.25@0.15A |
| Peak Non-Repetitive Forward Surge Current (A) |
4 |
| Peak Reverse Current (uA) |
0.005 |
| Peak Reverse Recovery Time (ns) |
3000 |
| Operating Junction Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Maximum Diode Capacitance (pF) |
2(Typ) |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
150 |
| Supplier Temperature Grade |
Automotive |
|
|
PACKAGE INFO
|
| Supplier Package |
SOD-323 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
2 |
| Lead Shape |
Gull-wing |
| PCB |
2 |
| Tab |
N/R |
| Pin Pitch (mm) |
N/R |
| Package Length (mm) |
1.7 |
| Package Width (mm) |
1.25 |
| Package Height (mm) |
1.05(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
2.5 |
| Package Overall Width (mm) |
1.25 |
| Package Overall Height (mm) |
0.95 |
| Seated Plane Height (mm) |
0.95 |
| Mounting |
Surface Mount |
| Terminal Width (mm) |
0.33 |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline Diode Package |
| Package Family Name |
SOD |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
| Maximum PACKAGE_DIMENSION_H (mm) |
1.05 |
| Minimum PACKAGE_DIMENSION_H (mm) |
N/A |
| Maximum PACKAGE_DIMENSION_L (mm) |
1.8 |
| Minimum PACKAGE_DIMENSION_L (mm) |
1.6 |
| Maximum PACKAGE_DIMENSION_W (mm) |
1.35 |
| Minimum PACKAGE_DIMENSION_W (mm) |
1.15 |
| Maximum Diameter (mm) |
N/R |
| Minimum Diameter (mm) |
N/R |
| Maximum Seated_Plane_Height (mm) |
1.1 |
| Minimum Seated_Plane_Height (mm) |
0.8 |
| Ball Array Length (mm) |
N/R |
| Ball Array Width (mm) |
N/R |
| Stand-off Height (mm) |
0.05(Max) |
| Number of Column Balls |
N/R |
| Number of Row Balls |
N/R |
| Terminal Length (mm) |
0.3 |
| Terminal Thickness (mm) |
0.18 |
| Bottom Pad Length (mm) |
N/R |
| Bottom Pad Width (mm) |
N/R |
| Bottom Pad Chamfer |
N/R |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
40 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
10 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Sn |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
4 Years |
| Shelf Life Condition |
8°C to 45°C+25 % to 75 % RH |
| Number of Wave Cycles |
N/A |
|
|
PACKAGING INFO
|
| Packaging Suffix |
115 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Reel Diameter (in) |
7 |
| Reel Width (mm) |
8 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Feed Hole Pitch (mm) |
4 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
| |
| APPLICATIONS |
| • Low-leakage current applications in surface mounted circuits |
| |
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