BC847B,215 Nexperia TRANS NPN 45V 0.1A SOT23

label:
2026/02/27 27
BC847B,215 Nexperia TRANS NPN 45V 0.1A SOT23


• General-purpose transistors
• SMD plastic packages
• Three different gain selections


CATALOG
BC847B,215 COUNTRY OF ORIGIN
BC847B,215 PARAMETRIC INFO
BC847B,215 PACKAGE INFO
BC847B,215 MANUFACTURING INFO
BC847B,215 PACKAGING INFO
BC847B,215 ECAD MODELS
BC847B,215 APPLICATIONS


COUNTRY OF ORIGIN
China
Malaysia


PARAMETRIC INFO
Type NPN
Configuration Single
Maximum Collector-Emitter Voltage (V) 45
Maximum Collector-Base Voltage (V) 50
Maximum Base-Emitter Voltage (V) 6
Maximum Pulsed Collector Current (A) 0.2
Maximum DC Collector Current (A) 0.1
Minimum Transition Frequency (MHz) 100
Maximum Power Dissipation (mW) 250
Collector Current for VCE Saturation (mA) 10|100
Maximum Noise Figure (dB) 10
Operating Junction Temperature (°C) 150
Maximum Emitter Cut-Off Current (nA) 100
Maximum Junction Ambient Thermal Resistance (°C/W) 500
Typical Input Capacitance (pF) 11
Typical Output Capacitance (pF) 1.5(Max)
Maximum Collector Cut-Off Current (nA) 15
Maximum Collector-Emitter Saturation Voltage (V) 0.2@0.5mA@10mA|0.4@5mA@100mA
Maximum Base-Emitter Saturation Voltage (V) 0.7(Typ)@0.5mA@10mA|0.9(Typ)@5mA@100mA
Category Bipolar Small Signal
Minimum DC Current Gain 200@2mA@5V
Number of Elements per Chip 1
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Minimum Operating Temperature (°C) -65
Maximum Operating Temperature (°C) 150
Supplier Temperature Grade Automotive


PACKAGE INFO
Supplier Package SOT-23
Basic Package Type Lead-Frame SMT
Pin Count 3
Lead Shape Gull-wing
PCB 3
Tab N/R
Pin Pitch (mm) 0.95
Package Length (mm) 2.9
Package Width (mm) 1.3
Package Height (mm) 1(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 2.9
Package Overall Width (mm) 2.3
Package Overall Height (mm) 1
Seated Plane Height (mm) 1
Mounting Surface Mount
Terminal Width (mm) 0.43
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline Transistor
Package Family Name SOT
Jedec TO-236AB
Package Outline Link to Datasheet
Maximum PACKAGE_DIMENSION_H (mm) 1
Minimum PACKAGE_DIMENSION_H (mm) N/A
Maximum PACKAGE_DIMENSION_L (mm) 3
Minimum PACKAGE_DIMENSION_L (mm) 2.8
Maximum PACKAGE_DIMENSION_W (mm) 1.4
Minimum PACKAGE_DIMENSION_W (mm) 1.2
Maximum Diameter (mm) N/R
Minimum Diameter (mm) N/R
Maximum Seated_Plane_Height (mm) 1.1
Minimum Seated_Plane_Height (mm) 0.9
Ball Array Length (mm) N/R
Ball Array Width (mm) N/R
Stand-off Height (mm) 0.1(Max)
Number of Column Balls N/R
Number of Row Balls N/R
Terminal Length (mm) 0.3
Terminal Thickness (mm) 0.12
Bottom Pad Length (mm) N/R
Bottom Pad Width (mm) N/R
Bottom Pad Chamfer N/R


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 40
Number of Reflow Cycle 3
Standard N/A
Maximum Wave Temperature (°C) 260
Wave Solder Time (Sec) 10
Lead Finish(Plating) Sn
Under Plating Material CuAg
Terminal Base Material FeNi Alloy
Shelf Life Period 4 Years
Shelf Life Condition 8°C to 45°C+25 % to 75 % RH
Number of Wave Cycles 1


PACKAGING INFO
Packaging Suffix 215
Packaging Tape and Reel
Quantity Of Packaging 3000
Reel Diameter (in) 7
Reel Width (mm) 8
Tape Pitch (mm) 4
Tape Width (mm) 8
Feed Hole Pitch (mm) 4
Component Orientation Q3
Packaging Document Link to Datasheet

ECAD MODELS


APPLICATIONS
• General-purpose switching and amplification
Продукт RFQ