|
|
• Non-repetitive peak reverse power dissipation: ≤ 100 W for types ≤ 6.8 V
|
• Non-repetitive peak reverse power dissipation: ≤ 40 W for types ≥ 7.5 V
|
• Total power dissipation: Ptot ≤ 550 mW
|
• Wide working voltage range: nominal 2.4 V to 75 V (E24 range)
|
• Two tolerance series: ± 2 % and ± 5 %
|
|
| CATALOG |
BZX84J-B36,115 COUNTRY OF ORIGIN
|
BZX84J-B36,115 PARAMETRIC INFO
|
BZX84J-B36,115 PACKAGE INFO
|
BZX84J-B36,115 MANUFACTURING INFO
|
BZX84J-B36,115 PACKAGING INFO
|
BZX84J-B36,115 APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
China
|
|
PARAMETRIC INFO
|
| Type |
Voltage Regulator |
| Configuration |
Single |
| Typical Zener Voltage (V) |
36 |
| Polarity |
Yes |
| Maximum Reverse Leakage Current (uA) |
0.05 |
| Maximum Zener Impedance (Ohm) |
60 |
| Maximum Power Dissipation @ 25C (mW) |
550 |
| Maximum Power Dissipation (mW) |
550 |
| Typical Voltage Temperature Coefficient |
33.9mV/K |
| Test Current (mA) |
2 |
| Maximum Zener Voltage (V) |
36.7 |
| Minimum Zener Voltage (V) |
35.3 |
| Maximum Forward Voltage (V) |
1.1 |
| Maximum Diode Capacitance (pF) |
59 |
| Average Rectified Forward Current (A) |
0.25 |
| Zener Voltage Tolerance |
2% |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
150 |
| Supplier Temperature Grade |
Automotive |
|
|
PACKAGE INFO
|
| Supplier Package |
SC-90 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
2 |
| Lead Shape |
Flat |
| PCB |
2 |
| Tab |
N/R |
| Pin Pitch (mm) |
N/R |
| Package Length (mm) |
1.7 |
| Package Width (mm) |
1.25 |
| Package Height (mm) |
0.7 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
2.5 |
| Package Overall Width (mm) |
1.25 |
| Package Overall Height (mm) |
0.7 |
| Seated Plane Height (mm) |
0.7 |
| Mounting |
Surface Mount |
| Terminal Width (mm) |
0.33 |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline Diode Package |
| Package Family Name |
SOD |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
| Maximum PACKAGE_DIMENSION_H (mm) |
0.8 |
| Minimum PACKAGE_DIMENSION_H (mm) |
0.65 |
| Maximum PACKAGE_DIMENSION_L (mm) |
1.8 |
| Minimum PACKAGE_DIMENSION_L (mm) |
1.6 |
| Maximum PACKAGE_DIMENSION_W (mm) |
1.35 |
| Minimum PACKAGE_DIMENSION_W (mm) |
1.15 |
| Maximum Diameter (mm) |
N/R |
| Minimum Diameter (mm) |
N/R |
| Maximum Seated_Plane_Height (mm) |
0.8 |
| Minimum Seated_Plane_Height (mm) |
0.65 |
| Ball Array Length (mm) |
N/R |
| Ball Array Width (mm) |
N/R |
| Stand-off Height (mm) |
N/A |
| Number of Column Balls |
N/R |
| Number of Row Balls |
N/R |
| Terminal Length (mm) |
0.4 |
| Terminal Thickness (mm) |
0.18 |
| Bottom Pad Length (mm) |
N/R |
| Bottom Pad Width (mm) |
N/R |
| Bottom Pad Chamfer |
N/R |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
40 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Sn |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
4 Years |
| Shelf Life Condition |
8°C to 45°C+25 % to 75 % RH |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
115 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Reel Diameter (in) |
7.09 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Feed Hole Pitch (mm) |
4 |
| Component Orientation |
Cathode At Sprocket Hole |
| Packaging Document |
Link to Datasheet |
|
|
APPLICATIONS
|
| • General regulation functions |
| |
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