|
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• 0.5 dB LSB Steps to 31.5 dB
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• Single Control Line Per Bit
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• TTL/CMOS Compatible Control
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• ± 0.25 dB Typical Step Error
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• Single +5V Supply
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|
| CATALOG |
HMC472ALP4ETR COUNTRY OF ORIGIN
|
HMC472ALP4ETR PARAMETRIC INFO
|
HMC472ALP4ETR PACKAGE INFO
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HMC472ALP4ETR MANUFACTURING INFO
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HMC472ALP4ETR PACKAGING INFO
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HMC472ALP4ETR ECAD MODELS
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HMC472ALP4ETR APPLICATIONS
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|
COUNTRY OF ORIGIN
|
Malaysia
|
|
PARAMETRIC INFO
|
| Number of Bits |
6 |
| Maximum Attenuation (dB) |
31.5(Typ) |
| Attenuator Step Size (dB) |
0.5 |
| Minimum Frequency (MHz) |
0 |
| Maximum Frequency (MHz) |
3800 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Minimum Operating Supply Voltage (V) |
4.5 |
| Typical Operating Supply Voltage (V) |
5 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Typical Insertion Loss (dB) |
1.9 |
| Maximum Input Power |
30dBm(Typ) |
| Maximum Supply Current (A) |
0.0026 |
| Maximum Power Dissipation (mW) |
560 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
LFCSP EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
24 |
| Lead Shape |
No Lead |
| PCB |
24 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
4 |
| Package Width (mm) |
4 |
| Package Height (mm) |
0.83 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
4 |
| Package Overall Width (mm) |
4 |
| Package Overall Height (mm) |
0.85 |
| Seated Plane Height (mm) |
0.85 |
| Mounting |
Surface Mount |
| Terminal Width (mm) |
0.25 |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Lead Frame Chip Scale Package, Exposed Pad |
| Package Family Name |
CSP |
| Jedec |
MO-220VGGD-8 |
| Package Outline |
Link to Datasheet |
| Maximum PACKAGE_DIMENSION_H (mm) |
0.85 |
| Minimum PACKAGE_DIMENSION_H (mm) |
N/A |
| Maximum PACKAGE_DIMENSION_L (mm) |
4.1 |
| Minimum PACKAGE_DIMENSION_L (mm) |
3.9 |
| Maximum PACKAGE_DIMENSION_W (mm) |
4.1 |
| Minimum PACKAGE_DIMENSION_W (mm) |
3.9 |
| Maximum Diameter (mm) |
N/R |
| Minimum Diameter (mm) |
N/R |
| Maximum Seated_Plane_Height (mm) |
0.9 |
| Minimum Seated_Plane_Height (mm) |
0.8 |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
12 Month |
| Shelf Life Condition |
40°C+90 % RH |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
TR |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
500 |
| Reel Diameter (in) |
7 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
| Tape Material |
Plastic |
| Tape Type |
Embossed |
|
|
| ECAD MODELS |
 |
|
| APPLICATIONS |
| • 3G Infrastructure & access points |
| • Cellular/3G, LTE & UMB |
| • WiMAX, WiBN & Fixed Wireless |
| • Test Equipment and Sensors |
| • GSM, WCDMA & TD-SCDMA |
| |
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