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• Single Inductor Buck-Boost Controller for StepUp/Step-Down DC/DC Conversio
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• Wide VIN Range: 3.5 V to 42 V, 60 V Maximum
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• Flexible VOUT Range: 0.8 V to 55 V
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• VOUT Short Protection
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• High Efficiency Buck-Boost Transition
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• Adjustable Switching Frequency
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• Optional Frequency Sync and Dithering
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| CATALOG |
LM5175PWPR COUNTRY OF ORIGIN
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LM5175PWPR PARAMETRIC INFO
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LM5175PWPR PACKAGE INFO
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LM5175PWPR MANUFACTURING INFO
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LM5175PWPR PACKAGING INFO
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LM5175PWPR ECAD MODELS
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LM5175PWPR APPLICATIONS
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COUNTRY OF ORIGIN
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United States of America
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Taiwan (Province of China)
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Malaysia
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PARAMETRIC INFO
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| Topology |
Step Down|Step Up |
| Number of Outputs |
1 |
| Maximum Switching Frequency (kHz) |
600 |
| Output Voltage (V) |
0.8 to 55 |
| Typical Output Current (A) |
20(Max) |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Maximum Input Voltage (V) |
42 |
| Minimum Input Voltage (V) |
3.5 |
| Synchronous Rectifier |
Yes |
| Operating Supply Voltage Range (V) |
3.5 to 42 |
| Synchronous Clock |
Yes |
| Minimum Switching Frequency (kHz) |
100 |
| Programmability |
Yes |
| Control Method |
PWM |
| Typical Quiescent Current (mA) |
1.65 |
| Typical Gate Driver Pull Up Resistance (Ohm) |
1.9 |
| Typical Gate Driver Pull Down Resistance (Ohm) |
1.3 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
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PACKAGE INFO
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| Supplier Package |
HTSSOP EP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
28 |
| Lead Shape |
Gull-wing |
| PCB |
28 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
9.8(Max) |
| Package Width (mm) |
4.5(Max) |
| Package Height (mm) |
1.05(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
9.8(Max) |
| Package Overall Width (mm) |
6.6(Max) |
| Package Overall Height (mm) |
1.2(Max) |
| Seated Plane Height (mm) |
1.2(Max) |
| Mounting |
Surface Mount |
| Terminal Width (mm) |
0.3(Max) |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Heat Sinked Thin Shrink Small Outline Package, Exposed Pad |
| Package Family Name |
SO |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2000 |
| Reel Diameter (in) |
13 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
16 |
| Packaging Document |
Link to Datasheet |
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| ECAD MODELS |
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| APPLICATIONS |
| • Automotive Start-Stop Systems |
| • Backup Battery and Supercapacitor Charging |
| • Industrial PC Power Supplies |
| • USB Power Delivery |
| • LED Lighting |
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