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• Integrated Inductor
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• Miniature 3.5 mm × 3.5 mm × 1.75 mm Package
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• 35-mm² Solution Size (Single Sided)
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• -40°C to 125°C Junction Temperature Range
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| CATALOG |
LMZ21701SILT COUNTRY OF ORIGIN
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LMZ21701SILT PARAMETRIC INFO
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LMZ21701SILT PACKAGE INFO
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LMZ21701SILT MANUFACTURING INFO
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LMZ21701SILT PACKAGING INFO
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LMZ21701SILT ECAD MODELS
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LMZ21701SILT APPLICATIONS
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COUNTRY OF ORIGIN
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Thailand
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China
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Taiwan (Province of China)
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PARAMETRIC INFO
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| Type |
Step Down |
| Number of Outputs |
1 |
| Output Voltage (V) |
0.9 to 6 |
| Maximum Output Current (A) |
1 |
| Regulation Condition Change In Line |
14V |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Switching Regulator |
Yes |
| Minimum Input Voltage (V) |
3 |
| Maximum Input Voltage (V) |
17 |
| Output Type |
Adjustable |
| Efficiency (%) |
93(Typ) |
| Load Regulation |
0.05%/A(Typ) |
| Line Regulation |
0.02%/V(Typ) |
| Maximum Switching Frequency (kHz) |
2500 |
| Typical Standby Current (mA) |
0.0015 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| On/Off Logic |
Positive |
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PACKAGE INFO
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| Supplier Package |
uSIP SMD EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
No Lead |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.8 |
| Package Length (mm) |
3.5 |
| Package Width (mm) |
3.5 |
| Package Height (mm) |
1.75(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.5 |
| Package Overall Width (mm) |
3.5 |
| Package Overall Height (mm) |
1.75(Max) |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Terminal Width (mm) |
0.4 |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Micro System In Package, Exposed Pad |
| Package Family Name |
SIP |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
| Maximum PACKAGE_DIMENSION_H (mm) |
1.75 |
| Minimum PACKAGE_DIMENSION_H (mm) |
N/A |
| Maximum PACKAGE_DIMENSION_L (mm) |
3.6 |
| Minimum PACKAGE_DIMENSION_L (mm) |
3.4 |
| Maximum PACKAGE_DIMENSION_W (mm) |
3.6 |
| Minimum PACKAGE_DIMENSION_W (mm) |
3.4 |
| Maximum Diameter (mm) |
N/R |
| Minimum Diameter (mm) |
N/R |
| Maximum Seated_Plane_Height (mm) |
1.75 |
| Minimum Seated_Plane_Height (mm) |
N/A |
| Ball Array Length (mm) |
N/R |
| Ball Array Width (mm) |
N/R |
| Stand-off Height (mm) |
N/A |
| Number of Column Balls |
N/R |
| Number of Row Balls |
N/R |
| Terminal Length (mm) |
0.45 |
| Terminal Thickness (mm) |
N/A |
| Bottom Pad Length (mm) |
2 |
| Bottom Pad Width (mm) |
2.5 |
| Bottom Pad Chamfer |
0.25 |
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MANUFACTURING INFO
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| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Ni |
| Terminal Base Material |
N/A |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging Suffix |
T |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
250 |
| Reel Diameter (in) |
7 |
| Reel Width (mm) |
13.2 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q2 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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APPLICATIONS
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• Point-of-Load Conversions from 3.3 V, 5 V, or 12 V Input Voltage
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| • Space Constrained Applications |
• LDO Replacement
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