|
|
• Optimized for Fast Transient Response
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• Output Current: 1.5A
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• Dropout Voltage: 340mV
|
• Low Noise: 40µVRMS (10Hz to 100kHz)
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• 1mA Quiescent Current
|
|
| CATALOG |
LT1963AEQ#TRPBF COUNTRY OF ORIGIN
|
LT1963AEQ#TRPBF PARAMETRIC INFO
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LT1963AEQ#TRPBF PACKAGE INFO
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LT1963AEQ#TRPBF MANUFACTURING INFO
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LT1963AEQ#TRPBF PACKAGING INFO
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LT1963AEQ#TRPBF ECAD MODELS
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LT1963AEQ#TRPBF APPLICATIONS
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|
COUNTRY OF ORIGIN
|
United States of America
|
Malaysia
|
|
PARAMETRIC INFO
|
| Type |
LDO |
| Number of Outputs |
1 |
| Maximum Output Current (A) |
1.5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Output Type |
Adjustable |
| Junction to Ambient |
30°C/W |
| Polarity |
Positive |
| Load Regulation |
8mV |
| Line Regulation |
5mV |
| Maximum Quiescent Current (mA) |
0.001 |
| Maximum Dropout Voltage @ Current (V) |
0.06@1mA|0.17@100mA|0.27@500mA|0.45@1.5A |
| Minimum Input Voltage (V) |
2.1 |
| Maximum Input Voltage (V) |
20 |
| Output Voltage (V) |
1.21 to 20 |
| Typical Quiescent Current (mA) |
1 |
| Typical Dropout Voltage @ Current (V) |
0.02@1mA|0.1@100mA|0.19@500mA|0.34@1.5A |
| Reference Voltage (V) |
1.21 |
| Accuracy (%) |
±1.5(Typ) |
| Supplier Temperature Grade |
Extended |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Typical Ground Current @ Full Load (mA) |
80 |
| Typical PSRR (dB) |
63 |
| Typical Output Capacitance (uF) |
10 |
| Typical Output Noise Voltage (uVrms) |
40 |
| Output Capacitor Type |
Ceramic |
|
|
PACKAGE INFO
|
| Supplier Package |
DDPAK |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
6 |
| Lead Shape |
Gull-wing |
| PCB |
5 |
| Tab |
Tab |
| Pin Pitch (mm) |
1.7 |
| Package Length (mm) |
10.22 |
| Package Width (mm) |
8.89 |
| Package Height (mm) |
4.38 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
10.22 |
| Package Overall Width (mm) |
14.05 |
| Package Overall Height (mm) |
4.48 |
| Seated Plane Height (mm) |
4.48 |
| Mounting |
Surface Mount |
| Terminal Width (mm) |
0.84 |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Double Deca Watt Package |
| Package Family Name |
TO-263 |
| Jedec |
TO-263BA |
| Package Outline |
Link to Datasheet |
| Maximum PACKAGE_DIMENSION_L (mm) |
10.54 |
| Minimum PACKAGE_DIMENSION_L (mm) |
9.91 |
| Maximum PACKAGE_DIMENSION_W (mm) |
9.4 |
| Minimum PACKAGE_DIMENSION_W (mm) |
8.38 |
| Maximum Diameter (mm) |
N/R |
| Minimum Diameter (mm) |
N/R |
| Minimum Seated_Plane_Height (mm) |
4.19 |
| Ball Array Length (mm) |
N/R |
| Ball Array Width (mm) |
N/R |
| Stand-off Height (mm) |
0.1 |
| Number of Column Balls |
N/R |
| Number of Row Balls |
N/R |
| Terminal Length (mm) |
1.27 |
| Terminal Thickness (mm) |
0.46 |
| Bottom Pad Length (mm) |
N/R |
| Bottom Pad Width (mm) |
N/R |
| Minimum PACKAGE_DIMENSION_H (mm) |
4.19 |
| Maximum PACKAGE_DIMENSION_H (mm) |
4.57 |
| Bottom Pad Chamfer |
N/R |
| Maximum Seated_Plane_Height (mm) |
4.88 |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
245 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
10 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
AgNi |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
2 |
|
|
PACKAGING INFO
|
| Packaging Suffix |
TR |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
750 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
24.4 |
| Tape Pitch (mm) |
16 |
| Tape Width (mm) |
24 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Component Orientation |
Tab Opposing Sprocket Hole |
| Packaging Document |
Link to Datasheet |
| Tape Type |
Embossed |
|
| |
| ECAD MODELS |
 |
|
| APPLICATIONS |
| • 3.3V to 2.5V Logic Power Supplies |
| • Post Regulator for Switching Supplies |
| |
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