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• Guard Ring Die Construction for Transient Protection
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• Low Power Loss, High Efficiency
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• Low Forward Voltage Drop
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• Very Low Leakage Current
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• High Forward Surge Current Capability
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• For use in low voltage, high frequency inverters, freewheeling,and polarity protection applications
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• Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
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| CATALOG |
PDS1040-13 PARAMETRIC INFO
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PDS1040-13 PACKAGE INFO
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PDS1040-13 MANUFACTURING INFO
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PDS1040-13 PACKAGING INFO
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PDS1040-13 ECAD MODELS
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PARAMETRIC INFO
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| Type |
Schottky Diode |
| Configuration |
Single Dual Anode |
| Maximum DC Reverse Voltage (V) |
40 |
| Peak Reverse Repetitive Voltage (V) |
40 |
| Maximum Continuous Forward Current (A) |
10 |
| Maximum Forward Voltage (V) |
0.51 |
| Peak Non-Repetitive Forward Surge Current (A) |
275 |
| Peak Reverse Current (uA) |
700 |
| Operating Junction Temperature (°C) |
-65 to 180 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Operating Temperature (°C) |
-65 |
| Maximum Operating Temperature (°C) |
180 |
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PACKAGE INFO
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| Supplier Package |
PowerDI 5 |
| Pin Count |
3 |
| PCB |
2 |
| Tab |
Tab |
| Pin Pitch (mm) |
1.84 |
| Package Length (mm) |
3.97 |
| Package Width (mm) |
5.37 |
| Package Height (mm) |
1.1(Max) |
| Package Diameter (mm) |
N/R |
| Mounting |
Surface Mount |
| Terminal Width (mm) |
0.89 |
| Package Material |
Plastic |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging Suffix |
13 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
5000 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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