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• SPI controller operating up to 1.8 Mbit/s
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• 1024-byte data buffer
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• Up to three targets select outputs
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• Up to three programmable I/O pins
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• Operating supply voltage: 1.71 V to 3.6 V
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• Low power mode
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• Active LOW interrupt output
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|
| CATALOG |
SC18IS606PWJ COUNTRY OF ORIGIN
|
SC18IS606PWJ PARAMETRIC INFO
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SC18IS606PWJ PACKAGE INFO
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SC18IS606PWJ MANUFACTURING INFO
|
SC18IS606PWJ PACKAGING INFO
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SC18IS606PWJ APPLICATIONS
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|
COUNTRY OF ORIGIN
|
Singapore
|
| China |
|
PARAMETRIC INFO
|
| Maximum Operating Temperature (°C) |
105 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Operating Temperature (°C) |
-40 |
| Minimum Storage Temperature (°C) |
-65 |
| Temperature Flag |
Opr |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Minimum Operating Supply Voltage (V) |
1.71 |
| Typical Operating Supply Voltage (V) |
2.5|3.3 |
| Maximum Supply Current (mA) |
4 |
| Function |
I2C to SPI Bridge |
| Interface Type |
I2C|SPI |
|
|
PACKAGE INFO
|
| Supplier Package |
TSSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
16 |
| Lead Shape |
Gull-wing |
| PCB |
16 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
5 |
| Package Width (mm) |
4.4 |
| Package Height (mm) |
0.9 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5 |
| Package Overall Width (mm) |
6.4 |
| Package Overall Height (mm) |
1 |
| Seated Plane Height (mm) |
1 |
| Mounting |
Surface Mount |
| Terminal Width (mm) |
0.25 |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Thin Shrink Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-153 |
| Package Outline |
Link to Datasheet |
| Maximum PACKAGE_DIMENSION_L (mm) |
5.1 |
| Minimum PACKAGE_DIMENSION_L (mm) |
4.9 |
| Maximum PACKAGE_DIMENSION_W (mm) |
4.5 |
| Minimum PACKAGE_DIMENSION_W (mm) |
4.3 |
| Maximum Diameter (mm) |
N/R |
| Minimum Diameter (mm) |
N/R |
| Minimum Seated_Plane_Height (mm) |
0.85 |
| Ball Array Length (mm) |
N/R |
| Ball Array Width (mm) |
N/R |
| Stand-off Height (mm) |
0.1 |
| Number of Column Balls |
N/R |
| Number of Row Balls |
N/R |
| Terminal Length (mm) |
0.63 |
| Terminal Thickness (mm) |
0.15 |
| Bottom Pad Length (mm) |
N/R |
| Bottom Pad Width (mm) |
N/R |
| Minimum PACKAGE_DIMENSION_H (mm) |
0.8 |
| Maximum PACKAGE_DIMENSION_H (mm) |
0.95 |
| Bottom Pad Chamfer |
N/R |
| Maximum Seated_Plane_Height (mm) |
1.1 |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
| PACKAGING INFO |
| Packaging Suffix |
J |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
12 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Feed Hole Pitch (mm) |
4 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
|
| APPLICATIONS |
| • Converting I2C-bus to SPI |
| • Adding additional SPI bus controllers to an existing system |
|
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