Si3127DV-T1-GE3 Vishay / Siliconix MOSFET P-CH 60V 3.5A/13A 6TSOP

label:
2026/04/30 97
Si3127DV-T1-GE3 Vishay / Siliconix MOSFET P-CH 60V 3.5A/13A 6TSOP


• TrenchFET® power MOSFET
• 100 % Rg and UIS tested
• Material categorization: For definitions of compliance please see www.vishay.com/doc?99912


CATALOG
Si3127DV-T1-GE3 COUNTRY OF ORIGIN
Si3127DV-T1-GE3 PARAMETRIC INFO
Si3127DV-T1-GE3 PACKAGE INFO
Si3127DV-T1-GE3 MANUFACTURING INFO
Si3127DV-T1-GE3 PACKAGING INFO
Si3127DV-T1-GE3 ECAD MODELS
Si3127DV-T1-GE3 APPLICATIONS


COUNTRY OF ORIGIN
Israel


PARAMETRIC INFO
Channel Type P
Channel Mode Enhancement
Configuration Single Quad Drain
Maximum Drain-Source Voltage (V) 60
Maximum Absolute Continuous Drain Current (A) 5.1
Maximum Continuous Drain Current (A) 5.1
Maximum Gate-Source Voltage (V) ±20
Maximum Drain-Source Resistance (mOhm) 89@10V
Typical Gate Charge @ Vgs (nC) 20@10V
Typical Gate Charge @ 10V (nC) 20
Maximum Power Dissipation (mW) 2000
Category Power MOSFET
Typical Input Capacitance @ Vds (pF) 832@30V
Typical Turn-On Delay Time (ns) 8
Typical Turn-Off Delay Time (ns) 35
Typical Fall Time (ns) 16
Typical Rise Time (ns) 6
Maximum Gate-Source Leakage Current (nA) 100
Maximum Gate Threshold Voltage (V) 3
Maximum IDSS (uA) 1
Number of Elements per Chip 1
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 150
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 150
 

PACKAGE INFO
Supplier Package TSOP
Pin Count 6
Lead Shape Gull-wing
PCB 6
Tab N/R
Pin Pitch (mm) 0.95
Package Length (mm) 3.05
Package Width (mm) 1.65
Package Height (mm) 1(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 3.05
Package Overall Width (mm) 2.85
Package Overall Height (mm) 1.1(Max)
Seated Plane Height (mm) 1.1(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Thin Small Outline Package
Package Family Name SO
Jedec N/A
Package Outline Link to Datasheet
 

MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 10
Number of Reflow Cycle 3
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Shelf Life Period 4 Years
Shelf Life Condition 5°C to 30°C+40 % to 70 % RH
 

PACKAGING INFO
Packaging Suffix T1
Packaging Tape and Reel
 

ECAD MODELS



APPLICATIONS
• Load switches
• DC/DC converter

Продукт RFQ