|
|
• Operating range: 2V to 5.5V VCC
|
• 8-bit serial-in, parallel-out shift
|
• Latch-up performance exceeds 100mA per JESD 78, class II
|
• ESD protection exceeds JESD 22– 2000V human-body model (A114-A)– 1000V charged-device model (C101)
|
|
| CATALOG |
SN74AHC595PWR COUNTRY OF ORIGIN
|
SN74AHC595PWR PARAMETRIC INFO
|
SN74AHC595PWR PACKAGE INFO
|
SN74AHC595PWR MANUFACTURING INFO
|
SN74AHC595PWR PACKAGING INFO
|
SN74AHC595PWR ECAD MODELS
|
SN74AHC595PWR APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
Taiwan (Province of China)
|
Philippines
|
Malaysia
|
China
|
|
PARAMETRIC INFO
|
| Logic Function |
Shift Register |
| Logic Family |
AHC |
| Process Technology |
130nm |
| Number of Count Input Enables |
0 |
| Number of Element Inputs |
1 |
| Number of Element Outputs |
9 |
| Number of Elements per Chip |
1 |
| Number of Selection Inputs per Element |
0 |
| Number of Stages |
8 |
| Operation Mode |
Serial to Serial/Parallel |
| Output Type |
3-State |
| Direction Type |
Uni-Directional |
| Terminal Count Output |
No |
| Triggering Type |
Positive-Edge |
| Minimum Operating Supply Voltage (V) |
2 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Typical Operating Supply Voltage (V) |
2.5|3.3|5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Maximum Propagation Delay Time @ Maximum CL (ns) |
16.5@3.3V|10.2@5V |
| Absolute Propagation Delay Time (ns) |
20 |
| Propagation Delay Test Condition (pF) |
50 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Parallel Enable Input |
No |
|
|
PACKAGE INFO
|
| Supplier Package |
TSSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
16 |
| Lead Shape |
Gull-wing |
| PCB |
16 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
5 |
| Package Width (mm) |
4.4 |
| Package Height (mm) |
1.05(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5 |
| Package Overall Width (mm) |
6.4 |
| Package Overall Height (mm) |
1.2(Max) |
| Seated Plane Height (mm) |
1.2(Max) |
| Mounting |
Surface Mount |
| Terminal Width (mm) |
0.24 |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Thin Shrink Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-153 |
| Package Outline |
Link to Datasheet |
| Maximum PACKAGE_DIMENSION_H |
1.05 |
| Minimum PACKAGE_DIMENSION_H |
N/A |
| Maximum PACKAGE_DIMENSION_L |
5.1 |
| Minimum PACKAGE_DIMENSION_L |
4.9 |
| Maximum PACKAGE_DIMENSION_W |
4.5 |
| Minimum PACKAGE_DIMENSION_W |
4.3 |
| Maximum Diameter |
N/R |
| Minimum Diameter |
N/R |
| Maximum Seated_Plane_Height |
1.2 |
| Minimum Seated_Plane_Height |
N/A |
| Ball Array Length (mm) |
N/R |
| Ball Array Width (mm) |
N/R |
| Stand-off Height (mm) |
0.1 |
| Number of Column Balls |
N/R |
| Number of Row Balls |
N/R |
| Terminal Length (mm) |
0.63 |
| Terminal Thickness (mm) |
0.15 |
| Bottom Pad Length (mm) |
N/R |
| Bottom Pad Width (mm) |
N/R |
| Bottom Pad Chamfer |
N/R |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn|Au |
| Under Plating Material |
N/A|Pd over Ni |
| Terminal Base Material |
Cu Alloy|N/A |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2000 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
12.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
| |
| ECAD MODELS |
 |
|
| APPLICATIONS |
| • Network Switches |
| • Power Infrastructures |
| • LED Displays |
| • Servers |
| |
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