VOMA617A-3X001T Vishay Semiconductors SINGLE CHANNEL, 80V, SOP-4 PHOTO

2025/12/2 3

• AEC-Q102 qualified

• High CTR with low input current

• SOP-4 low profile package

• High collector emitter voltage, VCEO = 80 V

• Isolation test voltage = 3750 VRMS

CATALOG

Malaysia

Input Type	DC
Output Type	DC
Output Device	Transistor
Standard	CQC\|cUL\|DIN\|UL
Number of Channels per Chip	1
Typical Forward Voltage (V)	1.33
Maximum Forward Voltage (V)	1.5
Maximum Forward Current (mA)	20
Maximum Collector Current (mA)	50
Maximum Reverse Voltage (V)	5
Maximum Collector-Emitter Voltage (V)	80
Maximum Collector-Emitter Saturation Voltage (mV)	400
Minimum Isolation Voltage (Vrms)	3750
Maximum Power Dissipation (mW)	180
Minimum Current Transfer Ratio (%)	100
Maximum Current Transfer Ratio (%)	200
Current Transfer Ratio Test Current (mA)	5
Typical Rise Time (us)	1.1
Typical Fall Time (us)	6.2
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	110
Supplier Temperature Grade	Automotive
Maximum Storage Temperature (°C)	150
Minimum Storage Temperature (°C)	-40

Supplier Package	SOP
Basic Package Type	Lead-Frame SMT
Pin Count	4
Lead Shape	Gull-wing
PCB	4
Tab	N/R
Pin Pitch (mm)	2.54
Package Length (mm)	4.92(Max)
Package Width (mm)	4.57
Package Height (mm)	2.12
Package Diameter (mm)	N/R
Package Overall Length (mm)	4.92(Max)
Package Overall Width (mm)	6.95
Package Overall Height (mm)	2.17
Seated Plane Height (mm)	2.17
Mounting	Surface Mount
Terminal Width (mm)	0.41
Package Weight (g)	N/A
Package Material	Plastic
Package Description	Plastic Small Outline Package
Package Family Name	SO
Jedec	N/A
Package Outline	Link to Datasheet
Maximum PACKAGE_DIMENSION_H	2.32
Minimum PACKAGE_DIMENSION_H	1.92
Maximum PACKAGE_DIMENSION_L	4.92
Minimum PACKAGE_DIMENSION_L	N/A
Maximum PACKAGE_DIMENSION_W	4.82
Minimum PACKAGE_DIMENSION_W	4.32
Maximum Diameter	N/R
Minimum Diameter	N/R
Maximum Seated_Plane_Height	2.42
Minimum Seated_Plane_Height	1.92

Packaging Suffix	T
Packaging	Tape and Reel
Quantity Of Packaging	2000
Reel Diameter (in)	13
Tape Pitch (mm)	8
Tape Width (mm)	12
Feed Hole Pitch (mm)	4
Hole Center to Component Center (mm)	2
Component Orientation	Q2
Packaging Document	Link to Datasheet

• Galvanic and noise isolation

• Signal transmission

• Hybrid / electric vehicle applications

• Battery management

• 48 V board net

• System control