Infineon Technologies AG Unveils Ultra-Compact 320A TLVR Four-Phase Power Module for Next-Gen AI Data Centers

Infineon Technologies AG has introduced a high–current-density, four-phase power module built around TLVR (Trans-Inductor Voltage Regulator) technology to address the escalating power requirements of advanced AI data centers. The new TDM24745T OptiMOS™ power module integrates four power stages, a TLVR inductor, and decoupling capacitors into a compact 9 × 10 × 5 mm³ package. Delivering an industry-leading current density of over 2 A/mm², the module provides exceptional transient performance and supports the high-current core rails demanded by modern GPUs and AI processors in both horizontal and vertical power delivery architectures.

According to Athar Zaidi, Senior Vice President and General Manager of Power ICs and Connectivity at Infineon, the rapid expansion of AI workloads is driving unprecedented demand for ultra-compact, highly efficient power solutions. The TDM24745T pushes the boundaries of high-current voltage regulation by combining TLVR architecture with extreme miniaturization, enabling customers to unlock greater compute capability, reduce energy consumption, and accelerate next-generation AI data center deployments.

As AI data centers continue to scale in power intensity, power architectures must become more space-efficient, responsive, and efficient. The TDM24745T addresses these needs by simplifying power design, increasing power density to free up PCB space for compute resources, and delivering ultra-fast transient response. The TLVR topology also allows up to a 50% reduction in required output capacitance, enabling more compact layouts, lowering overall system energy consumption, and improving total cost of ownership for AI server platforms.

As the industry’s first four-phase TLVR module in such a small footprint, the TDM24745T can supply up to 320 A peak current, making it especially well suited for next-generation AI processors and high-current multi-processor platforms. When paired with Infineon’s digital multiphase controllers, the module supports flexible and scalable power architectures, accelerating deployment in fast-evolving AI environments. Leveraging OptiMOS-6 MOSFET technology, chip-level integration, and proprietary magnetic design, it achieves superior efficiency and thermal performance even in the most densely packed AI server designs, helping enable more energy-efficient “AI factories.”

The TDM24745T integrates seamlessly into Infineon’s end-to-end AI server power ecosystem, which spans from grid interface to processor core rails. By combining the strengths of silicon (Si), silicon carbide (SiC), and gallium nitride (GaN) technologies, Infineon delivers comprehensive, scalable solutions optimized for AI-driven data center architectures, maximizing efficiency, robustness, and power density.