Nexperia Introduces Its First 40–100 V Automotive-Grade MOSFET Portfolio in Compact Leaded Packages
On September 11, Nexperia announced the launch of its first range of 40–100 V automotive-grade MOSFETs in industry-standard miniature leaded packages. The new lineup is designed for body control modules, infotainment systems, reverse battery protection, and automotive LED lighting.
The initial release includes 19 devices in the MLPAK33-WF package and Nexperia’s first 40 V MOSFET in the MLPAK56-WF package. Both feature wettable flanks (-WF), enabling reliable solder-joint inspection and full compatibility with automated optical inspection (AOI). These devices give engineers a flexible, cost-effective MOSFET selection with strong manufacturability and safety assurance.
Supporting the Shift to Zonal Vehicle Architectures
Automotive electrical systems are transitioning rapidly—from traditional ECU-based control, to domain control, and now to zonal architectures where multiple applications are managed within consolidated regional control units.
At the same time, the rise of on-board electronics, infotainment functions, and consumer-grade smart features is pushing OEMs to rethink classical design requirements to support these advanced in-vehicle experiences.
This evolution is driving demand for MOSFETs in DC/DC converters, inverters, and battery management systems, where components often operate at lower temperatures. These applications can benefit greatly from cost-efficient miniature leaded devices, such as Nexperia’s new MLPAK33-WF and MLPAK56-WF series.
In addition to their price-performance advantage, the devices meet traditional automotive expectations—AEC-Q101 qualification, stable and reliable electrical performance, high board-level robustness, and wettable flanks for AOI support—making them well suited for the fast-changing automotive landscape.
A Versatile Portfolio for Streamlined Design
This new product family offers engineers a wide selection of miniature leaded MOSFET options with various R<sub>DS(on)</sub> values in standardized footprints. The consistent packaging approach simplifies design workflows and allows smooth migration between different MOSFET configurations, accelerating adoption of Nexperia’s MLPAK technology.
The devices also deliver:
• Strong ruggedness
• Excellent switching performance with low overshoot and ringing
• High power density
• High avalanche capability that minimizes the need for external freewheeling diodes or bulky snubber circuits
These characteristics reduce component count and PCB area, lowering overall system cost.
A Significant Milestone for Nexperia’s MLPAK Roadmap
This release represents Nexperia’s first wave of MLPAK devices—a product line that will continue to expand. With proven quality, long-term reliability, and a robust global supply chain, Nexperia enables design engineers to confidently build high-efficiency automotive systems.