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• 1812 Chip Size, Fast Trip Time, Low DCR Resistance
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• Full compliance with EU Directive 2011/65/EU and amending directive 2015/863
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• AEC-Q Compliant
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• Meets Bel automotive qualification** - Largely based on internal AEC-Q test plan
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| CATALOG |
0ZCG0260AF2B COUNTRY OF ORIGIN
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0ZCG0260AF2B PARAMETRIC INFO
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0ZCG0260AF2B PACKAGE INFO
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0ZCG0260AF2B PACKAGING INFO
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0ZCG0260AF2B ECAD MODELS
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COUNTRY OF ORIGIN
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Taiwan (Province of China)
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China
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PARAMETRIC INFO
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| Trip Current (A) |
5 |
| Hold Current (A) |
2.6 |
| Maximum Voltage Rating |
13.2VDC |
| Maximum Current Rating (A) |
100 |
| Typical Power Dissipation (W) |
1.3 |
| Minimum Initial Resistance (Ohm) |
0.015 |
| Maximum Post Trip Resistance (Ohm) |
0.05 |
| Maximum Operating Temperature (°C) |
85 |
| Maximum Trip Time (s) |
5@8A |
| Application |
All High Density Boards |
| Minimum Operating Temperature (°C) |
-40 |
| Size (mm) |
4.73 X 3.41 X 1.55 |
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PACKAGE INFO
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| Package/Case |
1812 |
| Number of Terminals |
2 |
| Mounting |
Surface Mount |
| Terminal Pitch (mm) |
N/R |
| Product Length (mm) |
4.73(Max) |
| Product Depth (mm) |
3.41(Max) |
| Product Height (mm) |
1.55(Max) |
| Product Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
N/R |
| Termination Style |
Solder Pad |
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PACKAGING INFO
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| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1500 |
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ECAD MODELS
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One-stop supplier of IC products