TDK Launches IAM-20680HV: A High-Performance, Cost-Effective Six-Axis IMU for Automotive Applications
TDK Launches IAM-20680HV: A High-Performance, Cost-Effective Six-Axis IMU for Automotive Applications
Jun 27,2025
TDK Expands C Series MLCCs with Industry-Leading 100V, 1μF Capacitor in 1608 Size
TDK Expands C Series MLCCs with Industry-Leading 100V, 1μF Capacitor in 1608 Size
Jun 26,2025
Melexis Introduces MLX90427: A Cost-Effective, High-Performance Magnetic Position Sensor for Next-Gen Joysticks and HMI Applications
Melexis Introduces MLX90427: A Cost-Effective, High-Performance Magnetic Position Sensor for Next-Gen Joysticks and HMI Applications
Jun 20,2025
Microchip Expands dsPIC33A Family to Power High-Precision, Secure, Real-Time Embedded Applications
Microchip Expands dsPIC33A Family to Power High-Precision, Secure, Real-Time Embedded Applications
Jun 19,2025
Infineon Reaches 10 Billion Unit Milestone with Integrity Guard–Based Secure Controllers; Introduces New 32-Bit TEGRION™ SLC27G
Infineon Reaches 10 Billion Unit Milestone with Integrity Guard–Based Secure Controllers; Introduces New 32-Bit TEGRION™ SLC27G
Jun 13,2025
Infineon integrates CAPSENSE™ into PSOC™ HV microcontrollers for smart sensors and actuators including advanced touch sensing applications
Infineon integrates CAPSENSE™ into PSOC™ HV microcontrollers for smart sensors and actuators including advanced touch sensing applications
Jun 12,2025
Intel Expands Xeon 6 Lineup to Power Next-Generation GPU-Accelerated AI Systems
Intel Expands Xeon 6 Lineup to Power Next-Generation GPU-Accelerated AI Systems
Jun 06,2025
Acer Medical’s AI Tools Transform Eye and Bone Disease Screening Across Asia
Acer Medical’s AI Tools Transform Eye and Bone Disease Screening Across Asia
Jun 04,2025
Infineon Launches First Radiation-Hardened GaN Transistors Manufactured In-House for Space Applications
Infineon Launches First Radiation-Hardened GaN Transistors Manufactured In-House for Space Applications
May 30,2025
Cooling the Future: How Intel Is Tackling AI’s Heat Challenge
Cooling the Future: How Intel Is Tackling AI’s Heat Challenge
May 28,2025
Infineon and NVIDIA Redefine Power Delivery for Next-Gen AI Data Centers with 800V HVDC Architecture
Infineon and NVIDIA Redefine Power Delivery for Next-Gen AI Data Centers with 800V HVDC Architecture
May 23,2025
Bourns and TTI Celebrate 40 Years of Strategic Global Distribution Partnership
Bourns and TTI Celebrate 40 Years of Strategic Global Distribution Partnership
May 22,2025
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