|
|
• Working Peak Reverse Voltage Range − 5.8 V to 78 V
|
• Nominal Breakdown Voltage Range − 6.8 V to 91V
|
• Peak Power − 1500 W @ 1 ms
|
• ESD Rating of Class 3 (> 16 kV) per Human Body Model
|
• Low Leakage < 5 µA Above 10 V
|
• Maximum Temperature Coefficient Specified
|
• Response Time is Typically < 1 ns
|
• Pb−Free Packages are Available
|
|
1.5SMC39AT3G COUNTRY OF ORIGIN
|
| 1.5SMC39AT3G LIFECYCLE |
1.5SMC39AT3G PARAMETRIC INFO
|
1.5SMC39AT3G PACKAGE INFO
|
1.5SMC39AT3G MANUFACTURING INFO
|
1.5SMC39AT3G PACKAGING INFO
|
|
COUNTRY OF ORIGIN
|
Malaysia
|
|
| LIFECYCLE |
Obsolete
Dec 31,2017 |
|
PARAMETRIC INFO
|
| Configuration |
Single |
| Direction Type |
Uni-Directional |
| Maximum Reverse Stand-Off Voltage (V) |
33.3 |
| Minimum Breakdown Voltage (V) |
37.1 |
| Maximum Clamping Voltage (V) |
53.9 |
| Maximum Reverse Leakage Current (uA) |
5 |
| Maximum Breakdown Voltage (V) |
41 |
| Number of Elements per Chip |
1 |
| Maximum Peak Pulse Current (A) |
28 |
| Test Current (mA) |
1 |
| Operating Junction Temperature (°C) |
-65 to 150 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Peak Pulse Power Dissipation (W) |
1500 |
| Minimum Operating Temperature (°C) |
-65 |
| Maximum Operating Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
SMC |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
2 |
| Lead Shape |
J-Lead |
| PCB |
2 |
| Tab |
N/R |
| Pin Pitch (mm) |
N/R |
| Package Length (mm) |
6.86 |
| Package Width (mm) |
5.84 |
| Package Height (mm) |
2.13 |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
2.23 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
SMD Plastic Package |
| Package Family Name |
DO |
| Jedec |
DO-214AB |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
10 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
N/A |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
| Number of Wave Cycles |
N/A |
|
|
PACKAGING INFO
|
| Packaging Suffix |
T3 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Packaging Document |
Link to Datasheet |
|
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