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| CATALOG |
10018783-10102TLF COUNTRY OF ORIGIN
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10018783-10102TLF PARAMETRIC INFO
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10018783-10102TLF PACKAGE INFO
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10018783-10102TLF MANUFACTURING INFO
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10018783-10102TLF PACKAGING INFO
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COUNTRY OF ORIGIN
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China
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PARAMETRIC INFO
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| Type |
PCI Express Card Edge |
| Gender |
SKT |
| Number of Contacts |
98 |
| Termination Method |
Solder |
| Maximum Current Rating (A) |
1.1/Contact |
| Maximum Voltage Rating |
300VAC |
| Housing Material |
Glass Filled Nylon |
| Housing Color |
Black |
| Contact Material |
Copper Alloy |
| Contact Plating |
Gold Over Nickel |
| Number of Rows |
2 |
| Maximum Contact Resistance (mOhm) |
30 |
| Insulation Resistance (MOhm) |
1000 |
| Card Type |
PCI |
| Card Thickness (mm) |
1.57 |
| Mounting Styles |
Plastic Locating Post |
| Tail Length (mm) |
2.3 |
| Tail Cross Section (mm) |
0.35x0.25 |
| Contact Type |
Cantilever Bellows |
| Operating Temperature (°C) |
-55 to 85 |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
85 |
| Mating Cycle (Cycles) |
50 |
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PACKAGE INFO
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| Terminal Pitch (mm) |
1 |
| Body Orientation |
Straight |
| Mounting |
Through Hole |
| Product Length (mm) |
56 |
| Product Depth (mm) |
8.85 |
| Product Height (mm) |
11.25 |
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MANUFACTURING INFO
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| MSL |
N/R |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
10 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
N/A |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
Ni |
| Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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| Packaging |
Tray |
| Quantity Of Packaging |
40 |
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