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CATALOG |
10CL025YU256C8G COUNTRY OF ORIGIN |
10CL025YU256C8G PARAMETRIC INFO
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10CL025YU256C8G PACKAGE INFO
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10CL025YU256C8G MANUFACTURING INFO
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10CL025YU256C8G PACKAGING INFO
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COUNTRY OF ORIGIN
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Malaysia |
Indonesia
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Korea (Republic of)
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Taiwan (Province of China)
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Thailand
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PARAMETRIC INFO
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Device Logic Units |
24624 |
Device Logic Cells |
24624 |
Maximum Number of User I/Os |
150 |
Device Number of DLLs/PLLs |
4 |
Number of Multipliers |
66 (18x18) |
Tradename |
Cyclone |
RAM Bits (Kbit) |
594 |
Total Number of Block RAM |
66 |
Program Memory Type |
SRAM |
Family Name |
Cyclone® 10 LP |
Speed Grade |
8 |
Copy Protection |
No |
Programmability |
Yes |
In-System Programmability |
No |
Reprogrammability Support |
No |
I/O Voltage (V) |
1.2|1.5|1.8|2.5|3|3.3 |
Minimum Operating Temperature (°C) |
0 |
Maximum Operating Temperature (°C) |
85 |
Temperature Flag |
Jun |
Supplier Temperature Grade |
Commercial |
Digital Control Impedance |
No |
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PACKAGE INFO
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Supplier Package |
UFBGA |
Pin Count |
256 |
Lead Shape |
Ball |
PCB |
256 |
Tab |
N/R |
Package Length (mm) |
14 |
Package Width (mm) |
14 |
Package Height (mm) |
0.95 |
Package Diameter (mm) |
N/R |
Mounting |
Surface Mount |
Package Description |
Ultra Fine Pitch Ball Grid Array |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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MSL |
3 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
N/A |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
SnAgCu |
Under Plating Material |
N/A |
Terminal Base Material |
N/A |
Number of Wave Cycles |
N/R |
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PACKAGING INFO
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Packaging |
Tray |
Quantity Of Packaging |
119 |
Packaging Document |
Link to Datasheet |
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