10M02DCV36I7G Intel / Altera IC FPGA 27 I/O 36WLCSP

2023/08/24 554

CATALOG

Taiwan (Province of China)

Device Logic Units	2000
Device Logic Cells	2000
Maximum Number of User I/Os	27
Device Number of DLLs/PLLs	2
Number of Multipliers	16 (18x18)
RAM Bits (Kbit)	108
Program Memory Type	SRAM
Family Name	MAX 10
Process Technology	55nm
Speed Grade	7
Dedicated DSP	16
Differential I/O Standards Supported	LVDS\|SSTL\|HSUL
External Memory Interface	DDR2 SDRAM\|LPDDR2 SDRAM\|DDR3 SDRAM\|DDR3L SDRAM
Copy Protection	No
Shift Registers	Utilize Memory
Programmability	Yes
In-System Programmability	Yes
Reprogrammability Support	Yes
Number of Global Clocks	20
Maximum Operating Supply Voltage (V)	1.25
I/O Voltage (V)	1.2\|1.35\|1.5\|1.8\|2.5\|3\|3.3
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	100
Temperature Flag	Jun
Supplier Temperature Grade	Industrial
Digital Control Impedance	No
Minimum Operating Supply Voltage (V)	1.15
Typical Operating Supply Voltage (V)	1.2
Maximum Storage Temperature (°C)	150
Minimum Storage Temperature (°C)	-65

Supplier Package	VBGA
Basic Package Type	Ball Grid Array
Pin Count	36
Lead Shape	Ball
PCB	36
Tab	N/R
Pin Pitch (mm)	0.4
Package Length (mm)	3.47
Package Width (mm)	3.4
Package Height (mm)	0.33
Package Diameter (mm)	N/R
Seated Plane Height (mm)	0.46
Mounting	Surface Mount
Package Weight (g)	N/A
Package Description	Wafer Level Chip Scale Package
Package Family Name	BGA
Package Outline	Link to Datasheet

MSL	1
Maximum Reflow Temperature (°C)	N/A
Reflow Solder Time (Sec)	N/A
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Lead Finish(Plating)	N/A
Under Plating Material	N/A
Terminal Base Material	N/A