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| CATALOG |
1565917-4 COUNTRY OF ORIGIN
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1565917-4 PARAMETRIC INFO
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1565917-4 PACKAGE INFO
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1565917-4 MANUFACTURING INFO
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1565917-4 PACKAGING INFO
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COUNTRY OF ORIGIN
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China
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Hong Kong
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PARAMETRIC INFO
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| Type |
DDR2 SO DIMM |
| Gender |
SKT |
| Number of Contacts |
200 |
| Termination Method |
Solder |
| Maximum Current Rating (A) |
0.5/Contact |
| Maximum Voltage Rating |
25VAC |
| Housing Material |
High Temperature Thermoplastic |
| Contact Material |
Copper Alloy |
| Contact Plating |
Gold Over Nickel |
| Maximum Contact Resistance (mOhm) |
30 |
| Insulation Material |
High Temperature Thermoplastic |
| Insulation Resistance (MOhm) |
50 |
| Number of Rows |
2 |
| Row Spacing (mm) |
6.2 |
| Operating Temperature (°C) |
-55 to 85 |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
85 |
| Mating Cycle (Cycles) |
25 |
| Housing Color |
Black |
| Keyed |
Yes |
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PACKAGE INFO
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| Terminal Pitch (mm) |
0.6 |
| Body Orientation |
Right Angle |
| Mounting |
Surface Mount |
| Product Length (mm) |
71.5 |
| Product Depth (mm) |
26.5 |
| Product Height (mm) |
5.2 |
| Length Tolerance (mm) |
±0.3 |
| Depth Tolerance (mm) |
±0.3 |
| Height Tolerance (mm) |
±0.3 |
| Product Weight (g) |
N/A |
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MANUFACTURING INFO
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| MSL |
N/A |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
2 |
| Standard |
N/A |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging |
Tape and Reel |
| Quantity Of Packaging |
150 |
| Reel Diameter (in) |
13 |
| Tape Pitch (mm) |
32 |
| Tape Width (mm) |
88 |
| Hole Center to Component Center (mm) |
2 |
| Packaging Document |
Link to Datasheet |
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