 |
|
| • Standard Zener Breakdown Voltage Range − 3.3 V to 68 V |
| • ESD Rating of Class 3 (> 16 kV) per Human Body Model |
| • Flat Handling Surface for Accurate Placement |
| • Package Design for Top Slide or Bottom Circuit Board Mounting |
| • Low Profile Package |
| • Ideal Replacement for MELF Packages |
| • AEC−Q101 Qualified and PPAP Capable − SZ1SMA59xxBT3G |
| • SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements |
| • These are Pb−Free Devices*
|
|
| CATALOG |
| 1SMA5917BT3G COUNTRY OF ORIGIN |
| 1SMA5917BT3G PARAMETRIC INFO |
| 1SMA5917BT3G PACKAGE INFO |
| 1SMA5917BT3G MANUFACTURING INFO |
| 1SMA5917BT3G PACKAGING INFO |
|
| COUNTRY OF ORIGIN |
| Japan |
| Malaysia |
| United States of America |
| Viet Nam |
|
| PARAMETRIC INFO |
| Type |
Voltage Regulator |
| Configuration |
Single |
| Nominal Zener Voltage (V) |
4.7 |
| Maximum Reverse Leakage Current (uA) |
2.5 |
| Maximum Zener Impedance (Ohm) |
5 |
| Maximum Power Dissipation @ 25C (mW) |
500 |
| Maximum Power Dissipation (mW) |
1500 |
| Maximum Regulator Current (mA) |
319 |
| Test Current (mA) |
79.8 |
| Maximum Zener Voltage (V) |
4.94 |
| Minimum Zener Voltage (V) |
4.46 |
| Maximum Forward Voltage (V) |
1.2 |
| Zener Voltage Tolerance |
5% |
| Minimum Operating Temperature (°C) |
-65 |
| Maximum Operating Temperature (°C) |
150 |
|
| |
| PACKAGE INFO |
| Supplier Package |
SMA |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
2 |
| Lead Shape |
J-Lead |
| PCB |
2 |
| Tab |
N/R |
| Pin Pitch (mm) |
N/R |
| Package Length (mm) |
4.32 |
| Package Width (mm) |
2.6 |
| Package Height (mm) |
2 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5.21 |
| Package Overall Width (mm) |
2.6 |
| Package Overall Height (mm) |
2.1 |
| Seated Plane Height (mm) |
2.1 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
SMD Plastic Package |
| Package Family Name |
DO-214-AC |
| Jedec |
DO-214AC |
| Package Outline |
Link to Datasheet |
|
| |
| MANUFACTURING INFO |
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
CuFeZn |
| Number of Wave Cycles |
N/R |
|
| |
| PACKAGING INFO |
| Packaging Suffix |
T3 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
5000 |
| Packaging Document |
Link to Datasheet |
|
|
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