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| CATALOG |
2450AT18B100E COUNTRY OF ORIGIN
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2450AT18B100E PARAMETRIC INFO
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2450AT18B100E PACKAGE INFO
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2450AT18B100E MANUFACTURING INFO
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2450AT18B100E PACKAGING INFO
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COUNTRY OF ORIGIN
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Taiwan (Province of China)
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PARAMETRIC INFO
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| Type |
Chip |
| Minimum Frequency (MHz) |
2400 |
| Maximum Frequency (MHz) |
2500 |
| Typical Antenna Gain |
-0.5dBi |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Maximum Input Power (mW) |
3000 |
| Impedance (Ohm) |
50 |
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PACKAGE INFO
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| Supplier Package |
CSMD |
| Pin Count |
2 |
| PCB |
2 |
| Tab |
N/R |
| Package Length (mm) |
3.2 |
| Package Width (mm) |
1.6 |
| Package Height (mm) |
1.3 |
| Package Diameter (mm) |
N/R |
| Mounting |
Surface Mount |
| Package Material |
Ceramic |
| Package Description |
Ceramic Surface Mount Device |
| Package Family Name |
SMD |
| Jedec |
N/A |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
20 |
| Number of Reflow Cycle |
3 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
Ni |
| Terminal Base Material |
N/A |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging Suffix |
E |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
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