25LC128T-I/SN Microchip Technology IC EEPROM 128K SPI 10MHZ 8SOIC

label:
2024/01/12 310



• Maximum Clock: 10 MHz
• Low-Power CMOS Technology: - Write current (maximum): 5 mA at 5.5V, 10 MHz - Read current: 5 mA at 5.5V, 10 MHz - Standby current: 5 µA at 5.5V
• 16,384 x 8-Bit Organization
• 64-Byte Page
• Self-Timed Erase and Write Cycles (5 ms maximum)
• Block Write Protection: - Protect none, 1/4, 1/2 or all of array
• Built-In Write Protection: - Power-on/off data protection circuitry - Write enable latch - Write-protect pin
• Sequential Read
• High Reliability: - Endurance: 1,000,000 erase/write cycles - Data retention: >200 years - ESD protection: >4000V


CATALOG
25LC128T-I/SN COUNTRY OF ORIGIN
25LC128T-I/SN PARAMETRIC INFO
25LC128T-I/SN PACKAGE INFO
25LC128T-I/SN MANUFACTURING INFO
25LC128T-I/SN PACKAGING INFO
25LC128T-I/SN ECAD MODELS


COUNTRY OF ORIGIN
Malaysia
Thailand
China
Philippines
Singapore
Taiwan (Province of China)


PARAMETRIC INFO
Density (bit) 128K
Interface Type Serial-SPI
Maximum Operating Frequency (MHz) 10
Maximum Access Time (ns) 50
Typical Operating Supply Voltage (V) 3.3|5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Programmability Yes
Density in Bits (bit) 131072
Maximum Operating Current (mA) 5
Hardware Data Protection Yes
Organization 16Kx8
Data Retention (Year) 200(Min)
Minimum Operating Supply Voltage (V) 2.5
Maximum Operating Supply Voltage (V) 5.5
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150


PACKAGE INFO
Supplier Package SOIC N
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Package Length (mm) 4.9
Package Width (mm) 3.9
Package Height (mm) 1.25(Min)
Package Diameter (mm) N/R
Mounting Surface Mount
Package Description Small Outline IC Narrow Body
Package Family Name SO
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1|3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 20 to 40
Number of Reflow Cycle 3
Standard J-STD-020C
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Suffix T
Packaging Tape and Reel
Quantity Of Packaging 3300


ECAD MODELS


Продукт RFQ