
|
|
• Maximum Clock: 10 MHz
|
• Low-Power CMOS Technology:
- Write current (maximum): 5 mA at 5.5V,
10 MHz
- Read current: 5 mA at 5.5V, 10 MHz
- Standby current: 5 µA at 5.5V
|
• 16,384 x 8-Bit Organization
|
• 64-Byte Page
|
• Self-Timed Erase and Write Cycles
(5 ms maximum)
|
| • Block Write Protection:
- Protect none, 1/4, 1/2 or all of array
|
| • Built-In Write Protection:
- Power-on/off data protection circuitry
- Write enable latch
- Write-protect pin |
| • Sequential Read |
| • High Reliability:
- Endurance: 1,000,000 erase/write cycles
- Data retention: >200 years
- ESD protection: >4000V |
|
| CATALOG |
25LC128T-I/SN COUNTRY OF ORIGIN
|
25LC128T-I/SN PARAMETRIC INFO
|
25LC128T-I/SN PACKAGE INFO
|
25LC128T-I/SN MANUFACTURING INFO
|
25LC128T-I/SN PACKAGING INFO
|
25LC128T-I/SN ECAD MODELS
|
|
COUNTRY OF ORIGIN
|
| Malaysia |
| Thailand |
| China |
Philippines
|
| Singapore |
| Taiwan (Province of China) |
|
PARAMETRIC INFO
|
| Density (bit) |
128K |
| Interface Type |
Serial-SPI |
| Maximum Operating Frequency (MHz) |
10 |
| Maximum Access Time (ns) |
50 |
| Typical Operating Supply Voltage (V) |
3.3|5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Programmability |
Yes |
| Density in Bits (bit) |
131072 |
| Maximum Operating Current (mA) |
5 |
| Hardware Data Protection |
Yes |
| Organization |
16Kx8 |
| Data Retention (Year) |
200(Min) |
| Minimum Operating Supply Voltage (V) |
2.5 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
SOIC N |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Package Length (mm) |
4.9 |
| Package Width (mm) |
3.9 |
| Package Height (mm) |
1.25(Min) |
| Package Diameter (mm) |
N/R |
| Mounting |
Surface Mount |
| Package Description |
Small Outline IC Narrow Body |
| Package Family Name |
SO |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1|3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
20 to 40 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020C |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
T |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3300 |
|
|
ECAD MODELS
|

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