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• Maximum Clock: 10 MHz
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• Low-Power CMOS Technology:
- Write current (maximum): 5 mA at 5.5V,
10 MHz
- Read current: 5 mA at 5.5V, 10 MHz
- Standby current: 5 µA at 5.5V
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• 16,384 x 8-Bit Organization
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• 64-Byte Page
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• Self-Timed Erase and Write Cycles
(5 ms maximum)
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• Block Write Protection:
- Protect none, 1/4, 1/2 or all of array
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• Built-In Write Protection:
- Power-on/off data protection circuitry
- Write enable latch
- Write-protect pin |
• Sequential Read |
• High Reliability:
- Endurance: 1,000,000 erase/write cycles
- Data retention: >200 years
- ESD protection: >4000V |
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CATALOG |
25LC128T-I/SN COUNTRY OF ORIGIN
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25LC128T-I/SN PARAMETRIC INFO
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25LC128T-I/SN PACKAGE INFO
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25LC128T-I/SN MANUFACTURING INFO
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25LC128T-I/SN PACKAGING INFO
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25LC128T-I/SN ECAD MODELS
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COUNTRY OF ORIGIN
|
Malaysia |
Thailand |
China |
Philippines
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Singapore |
Taiwan (Province of China) |
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PARAMETRIC INFO
|
Density (bit) |
128K |
Interface Type |
Serial-SPI |
Maximum Operating Frequency (MHz) |
10 |
Maximum Access Time (ns) |
50 |
Typical Operating Supply Voltage (V) |
3.3|5 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Supplier Temperature Grade |
Industrial |
Programmability |
Yes |
Density in Bits (bit) |
131072 |
Maximum Operating Current (mA) |
5 |
Hardware Data Protection |
Yes |
Organization |
16Kx8 |
Data Retention (Year) |
200(Min) |
Minimum Operating Supply Voltage (V) |
2.5 |
Maximum Operating Supply Voltage (V) |
5.5 |
Minimum Storage Temperature (°C) |
-65 |
Maximum Storage Temperature (°C) |
150 |
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PACKAGE INFO
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Supplier Package |
SOIC N |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
8 |
Lead Shape |
Gull-wing |
PCB |
8 |
Tab |
N/R |
Package Length (mm) |
4.9 |
Package Width (mm) |
3.9 |
Package Height (mm) |
1.25(Min) |
Package Diameter (mm) |
N/R |
Mounting |
Surface Mount |
Package Description |
Small Outline IC Narrow Body |
Package Family Name |
SO |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
|
MSL |
1|3 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
20 to 40 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020C |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Matte Sn annealed |
Under Plating Material |
N/A |
Terminal Base Material |
Cu Alloy |
Number of Wave Cycles |
N/R |
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PACKAGING INFO
|
Packaging Suffix |
T |
Packaging |
Tape and Reel |
Quantity Of Packaging |
3300 |
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ECAD MODELS
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