|
|
| • Programmable − RBB, , IV and IP |
| • Low On−State Voltage − 1.5 V Maximum @ IF = 50 mA
|
| • Low Gate to Anode Leakage Current − 10 nA Maximum |
| • High Peak Output Voltage − 11 V Typical
|
| • Low Offset Voltage − 0.35 V Typical (RG = 10 k) |
| • Pb−Free Packages are Available* |
|
| CATALOG |
| 2N6027G COUNTRY OF ORIGIN |
| 2N6027G PARAMETRIC INFO |
| 2N6027G PACKAGE INFO |
| 2N6027G MANUFACTURING INFO |
| 2N6027G PACKAGING INFO |
| 2N6027G ECAD MODELS |
|
| COUNTRY OF ORIGIN |
| Thailand |
|
| PARAMETRIC INFO |
| Type |
PUT |
| Repetitive Peak Reverse Voltage (V) |
40 |
| Rated Average On-State Current (A) |
0.15 |
| Maximum Gate Peak Inverse Voltage (V) |
5 |
| Operating Junction Temperature (°C) |
-50 to 125 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
150 |
| Repetitive Peak Forward Blocking Voltage (V) |
40 |
| Surge Current Rating (A) |
5 |
| Minimum Operating Temperature (°C) |
-50 |
| Maximum Operating Temperature (°C) |
100 |
|
|
| PACKAGE INFO |
| Supplier Package |
TO-92 |
| Basic Package Type |
Through Hole |
| Pin Count |
3 |
| Lead Shape |
Through Hole |
| PCB |
3 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.39(Max) |
| Package Length (mm) |
5.2(Max) |
| Package Width (mm) |
4.19(Max) |
| Package Height (mm) |
5.33(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
5.33(Max) |
| Mounting |
Through Hole |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Plastic Header Style Package |
| Package Family Name |
TO |
| Jedec |
TO-226-AA |
|
|
| MANUFACTURING INFO |
| MSL |
N/R |
| Maximum Reflow Temperature (°C) |
N/R |
| Reflow Solder Time (Sec) |
N/R |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
10 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
SnAgCu |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
|
| PACKAGING INFO |
| Packaging |
Box |
| Quantity Of Packaging |
5000 |
| Packaging Document |
Link to Datasheet |
|
|
| ECAD MODELS |
|
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