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• Smallest amplified sensor package
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• Minimal PCB space
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• Fully signal conditioned
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• Operating temperature range from −45° to +125°C
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• Silicon piezoresistive technology
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• Monolithic design
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| CATALOG |
40PC250G1A COUNTRY OF ORIGIN
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40PC250G1A PARAMETRIC INFO
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40PC250G1A PACKAGE INFO
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40PC250G1A MANUFACTURING INFO
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COUNTRY OF ORIGIN
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China
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PARAMETRIC INFO
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| Device Pressure Type |
Gage |
| Equivalent Overload Pressure Range (psi) |
500 to 1500 |
| Maximum Operating Supply Voltage (V) |
5 |
| Maximum Operating Temperature (°C) |
125 |
| Maximum Overload Pressure |
500psi |
| Maximum Storage Temperature (°C) |
125 |
| Maximum Supply Current (mA) |
10 |
| Minimum Operating Supply Voltage (V) |
4.75 |
| Minimum Operating Temperature (°C) |
-40 |
| Minimum Storage Temperature (°C) |
-55 |
| Operating Pressure Range |
0psi to 250psi |
| Media |
Gas |
| Typical Full Scale Output |
4.5VDC |
| Typical Operating Supply Voltage (V) |
5 |
| Accuracy (%) |
±3 |
| Operating Supply Voltage Range (V) |
5(Max) |
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PACKAGE INFO
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| Supplier Package |
DIP |
| Basic Package Type |
Through Hole |
| Pin Count |
6 |
| Lead Shape |
Through Hole |
| PCB |
6 |
| Tab |
N/R |
| Pin Pitch (mm) |
2.54 |
| Package Length (mm) |
13.2 |
| Package Width (mm) |
11.2 |
| Package Height (mm) |
19.8 |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
N/A |
| Mounting |
Through Hole |
| Package Weight (g) |
N/A |
| Package Material |
N/A |
| Package Description |
Dual In Line Package |
| Package Family Name |
DIP |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
N/R |
| Maximum Reflow Temperature (°C) |
N/R |
| Reflow Solder Time (Sec) |
N/R |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
260 to 270 |
| Wave Solder Time (Sec) |
5 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
N/A |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
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