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• Smallest amplified sensor package
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• Minimal PCB space
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• Fully signal conditioned
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• Operating temperature range from −45° to +125°C
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• Silicon piezoresistive technology
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• Monolithic design
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• 6 Pin DIP package
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• Port designed for O-ring interface
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• Excellent media compatibility
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• Accuracy of 0.2%
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| CATALOG |
40PC250G2A COUNTRY OF ORIGIN
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40PC250G2A PARAMETER INFORMATION
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40PC250G2A PACKAGING INFORMATION
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40PC250G2A MANUFACTURING INFORMATION
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COUNTRY OF ORIGIN
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China
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PARAMETER INFORMATION
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| Device Pressure Type |
Gage |
| Equivalent Overload Pressure Range (psi) |
500 to 1500 |
| Maximum Operating Supply Voltage (V) |
5 |
| Maximum Operating Temperature (°C) |
125 |
| Maximum Overload Pressure |
500psi |
| Maximum Storage Temperature (°C) |
125 |
| Maximum Supply Current (mA) |
10 |
| Minimum Operating Supply Voltage (V) |
4.75 |
| Minimum Operating Temperature (°C) |
-40 |
| Minimum Storage Temperature (°C) |
-55 |
| Operating Pressure Range |
0psi to 250psi |
| Media |
Gas |
| Typical Full Scale Output |
4.5VDC |
| Typical Operating Supply Voltage (V) |
5 |
| Accuracy (%) |
±3 |
| Operating Supply Voltage (V) |
5(Max) |
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PACKAGING INFORMATION
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| Supplier Packaging |
DIP |
| Basic package types |
Through Hole |
| Number of Pins |
6 |
| Pin shape |
Through Hole |
| PCB |
6 |
| Ear piece |
N/R |
| Pin spacing (mm) |
2.54 |
| Package length (mm) |
13.2 |
| Package width (mm) |
11.2 |
| Package height (mm) |
19.8 |
| Package diameter (mm) |
N/R |
| Mounting surface height (mm) |
19.8 |
| Install |
Through Hole |
| Package weight (g) |
not applicable |
| Packaging materials |
not applicable |
| package instruction |
Dual In Line Package |
| Package Series Name |
DIP |
| JEDEC |
not applicable |
| Package Outline |
Link to data sheet |
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MANUFACTURING INFORMATION
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| MSL |
N/R |
| Maximum reflow temperature (°C) |
N/R |
| Reflow time (seconds) |
N/R |
| Maximum wave soldering temperature (°C) |
260 to 270 |
| Wave soldering time (seconds) |
5 |
| Wave soldering temperature source |
Link to data sheet |
| Lead Finish(Plating) |
not applicable |
| Plating materials |
not applicable |
| Terminal base material |
not applicable |
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