|
|
• Single-pin or complementary CMOS
logic control inputs
|
• Low insertion loss: 0.35 dB @ 1000 MHz 0.5 dB @ 2000 MHz
|
• Isolation of 30 dB @ 1000 MHz
|
• High ESD tolerance of 2 kV HBM
|
• Typical input 1 dB compression point
of +33.5 dBm
|
| • 1.8V minimum power supply voltage |
| • Ultra-small SC-70 package |
|
| CATALOG |
4259-63 PARAMETRIC INFO
|
4259-63 PACKAGE INFO
|
4259-63 MANUFACTURING INFO
|
4259-63 PACKAGING INFO
|
4259-63 ECAD MODELS
|
4259-63 FUNCTIONAL DIAGRAM
|
|
PARAMETRIC INFO
|
| Switch Type |
SPDT |
| Number of Switches |
1 |
| Switch Configuration |
Single SPDT |
| Frequency Band (MHz) |
10 to 3000 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Process Technology |
UltraCMOS |
| Maximum Insertion Loss (dB) |
0.6 |
| Typical Operating Supply Voltage (V) |
3 |
| Maximum Frequency (MHz) |
3000 |
| Technology |
UltraCMOS |
| Switching Speed (ns) |
1500 |
| Minimum Operating Supply Voltage (V) |
1.8 |
| Maximum Operating Supply Voltage (V) |
3.3 |
| Operating Supply Voltage (V) |
3 |
| Minimum Isolation Voltage (dB) |
19 |
| Typical Supply Current (mA) |
0.009 |
| Typical Input 1dB Compressed Power (dBm) |
33.5 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
SC-70 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
6 |
| Lead Shape |
Gull-wing |
| PCB |
6 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
2.05 |
| Package Width (mm) |
1.25 |
| Package Height (mm) |
0.9 |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
0.95 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
MO-223AB |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
|
|
FUNCTIONAL DIAGRAM
|
|
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| |
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