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|
| CATALOG |
| 5040500691 COUNTRY OF ORIGIN |
| 5040500691 PARAMETRIC INFO |
| 5040500691 PACKAGE INFO |
| 5040500691 MANUFACTURING INFO |
| 5040500691 PACKAGING INFO |
| 5040500691 ECAD MODELS |
|
| COUNTRY OF ORIGIN |
| China |
| Japan |
| Malaysia |
| United States of America |
|
| PARAMETRIC INFO |
| Type |
Wire to Board |
| Gender |
HDR |
| Number of Contacts |
6 |
| Termination Method |
Solder |
| Tradename |
Pico-Lock |
| Maximum Current Rating (A) |
3/Contact |
| Maximum Voltage Rating |
150VDC|150VAC |
| Housing Material |
Polyamide |
| Housing Color |
Black |
| Contact Material |
Copper Alloy |
| Contact Plating |
Gold Over Nickel |
| Number of Rows |
1 |
| Maximum Contact Resistance (mOhm) |
20 |
| Polarization Type |
Dual Slot |
| Insulation Resistance (MOhm) |
1000 |
| Operating Temperature (°C) |
-40 to 105 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
105 |
| Mating Cycle (Cycles) |
30 |
| Minimum Storage Temperature (°C) |
-40 |
| Maximum Storage Temperature (°C) |
105 |
| Contact Plating Thickness |
(1/1)um |
| Mating Length (mm) |
6.1 |
|
| |
| PACKAGE INFO |
| Terminal Pitch (mm) |
1.5 |
| Body Orientation |
Right Angle |
| Mounting |
Surface Mount |
| Product Length (mm) |
13.55 |
| Product Depth (mm) |
6.44 |
| Product Height (mm) |
2 |
| Length Tolerance (mm) |
±0.2 |
| Depth Tolerance (mm) |
±0.2 |
| Height Tolerance (mm) |
±0.2 |
| Product Weight (g) |
0.1599 |
|
| |
| MANUFACTURING INFO |
| MSL |
N/R |
| Maximum Reflow Temperature (°C) |
250 |
| Reflow Solder Time (Sec) |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Ni |
| Terminal Base Material |
Cu Alloy |
|
| |
| PACKAGING INFO |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2700 |
| Tape Width (mm) |
24 |
| Packaging Document |
Link to Datasheet |
| Tape Type |
Embossed |
|
| |
| ECAD MODELS |
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