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• Packaged in 28-pin SSOP (150 mil body)
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• Pb (lead) free package, RoHS compliant
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• General purpose programmable divider
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• Supports ICS673 PLL Building Block
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• User determines the divide by setting input pins
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• Pull-ups on all select inputs
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• Includes one 7-bit Divider for OUTA
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• Includes one 9-bit Divider and one selectable Post Divider for OUTB
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• Industrial temperature range available
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| CATALOG |
674R-01ILF COUNTRY OF ORIGIN
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| 674R-01ILF LIFECYCLE |
674R-01ILF PARAMETRIC INFO
|
674R-01ILF PACKAGE INFO
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674R-01ILF MANUFACTURING INFO
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674R-01ILF PACKAGING INFO
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COUNTRY OF ORIGIN
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China
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Taiwan (Province of China)
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Malaysia
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Indonesia
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Philippines
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| LIFECYCLE |
Obsolete
Apr 26,2019 |
|
PARAMETRIC INFO
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| Type |
Divider Buffer |
| Fanout |
1:1 |
| Number of Outputs per Chip |
2 |
| Maximum Input Frequency (MHz) |
235 |
| Input Logic Level |
LVCMOS|TTL |
| Output Logic Level |
LVCMOS|TTL |
| Minimum Operating Supply Voltage (V) |
3 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Maximum Duty Cycle |
98.5% |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Typical Operating Supply Voltage (V) |
3.3|5 |
| Maximum Quiescent Current (mA) |
5(Typ) |
| Number of Clock Inputs |
2 |
| Spread Spectrum |
No |
| Maximum Output Frequency (MHz) |
235 |
| Input Signal Type |
Single-Ended |
| Power Supply Type |
Single |
| Maximum Propagation Delay Time @ Maximum CL (ns) |
20(Typ)@3.3V|13(Typ)@5V |
| Absolute Propagation Delay Time (ns) |
20(Typ) |
|
|
PACKAGE INFO
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| Supplier Package |
QSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
28 |
| Lead Shape |
Gull-wing |
| PCB |
28 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.64 |
| Package Length (mm) |
9.9 |
| Package Width (mm) |
3.8 |
| Package Height (mm) |
1.5(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Quarter Size Outline Package Or Quality Small Outline Package |
| Package Family Name |
SO |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
|
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| PACKAGING INFO |
| Packaging |
Tube |
| Quantity Of Packaging |
2500 |
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