74ACT251SCX onsemi / Fairchild MULTIPLEXER 8INPUT 3ST 16SOIC

label:
2024/12/18 95
74ACT251SCX onsemi / Fairchild 	MULTIPLEXER 8INPUT 3ST 16SOIC


CATALOG
74ACT251SCX COUNTRY OF ORIGIN
74ACT251SCX LIFECYCLE
74ACT251SCX PARAMETRIC INFO
74ACT251SCX PARAMETRIC INFO
74ACT251SCX MANUFACTURING INFO
74ACT251SCX PACKAGING INFO
74ACT251SCX ECAD MODELS


COUNTRY OF ORIGIN
Malaysia


LIFECYCLE
Obsolete
Mar 02,2011


PARAMETRIC INFO
Logic Function Multiplexer
Configuration 1 x 8:1
Number of Elements per Chip 1
Number of Inputs per Chip 8
Number of Outputs per Chip 1
Number of Input Enables per Element 0
Number of Output Enables per Element 1
Number of Selection Inputs per Element 3
Input Signal Type Single-Ended
Output Signal Type Differential
Output Type 3-State
Parity Invert Input No
Polarity Inverting/Non-Inverting
Logic Family ACT
Process Technology CMOS
Minimum Operating Supply Voltage (V) 4.5
Maximum Operating Supply Voltage (V) 5.5
Typical Operating Supply Voltage (V) 5
Power Supply Type Single
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Maximum Propagation Delay Time @ Maximum CL (ns) 12.5@5V
Absolute Propagation Delay Time (ns) 18.5
Propagation Delay Test Condition (pF) 50
Maximum High Level Output Current (mA) -24
Maximum Low Level Output Current (mA) 24
Maximum Quiescent Current (uA) 4


PARAMETRIC INFO
Supplier Package SOIC N
Basic Package Type Lead-Frame SMT
Pin Count 16
Lead Shape Gull-wing
PCB 16
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 10(Max)
Package Width (mm) 4(Max)
Package Height (mm) 1.5(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 10(Max)
Package Overall Width (mm) 6
Package Overall Height (mm) 1.75(Max)
Seated Plane Height (mm) 1.75(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline IC Narrow Body
Package Family Name SO
Jedec MS-012AC
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard IPC-1752
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) 260
Wave Solder Time (Sec) 5 to 6
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy
Number of Wave Cycles 2


PACKAGING INFO
Packaging Suffix X
Packaging Tape and Reel


ECAD MODELS


Продукт RFQ