74AHCT125PW,118 Nexperia IC BUF NON-INVERT 5.5V 14TSSOP

2025/04/9 169

CATALOG

China

Thailand

Process Technology	CMOS
Logic Family	AHCT
Logic Function	Buffer/Line Driver
Input Signal Type	Single-Ended
Output Type	3-State
Polarity	Non-Inverting
Bus Hold	No
Number of Elements per Chip	4
Number of Channels per Chip	4
Number of Output Enables per Chip	4 Low
Number of Input Enables per Chip	0
Number of Inputs per Chip	4
Number of Outputs per Chip	4
Minimum Operating Supply Voltage (V)	4.5
Maximum Operating Supply Voltage (V)	5.5
Typical Operating Supply Voltage (V)	5
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	125
Maximum Power Dissipation (mW)	500
Maximum Propagation Delay Time @ Maximum CL (ns)	7.5@4.5V to 5.5V
Absolute Propagation Delay Time (ns)	11
Propagation Delay Test Condition (pF)	50
Maximum High Level Output Current (mA)	-8
Maximum Low Level Output Current (mA)	8
Maximum Quiescent Current (uA)	2

Supplier Package	TSSOP
Basic Package Type	Lead-Frame SMT
Pin Count	14
Lead Shape	Gull-wing
PCB	14
Tab	N/R
Pin Pitch (mm)	0.65
Package Length (mm)	5.1(Max)
Package Width (mm)	4.5(Max)
Package Height (mm)	0.95(Max)
Package Diameter (mm)	N/R
Seated Plane Height (mm)	1.1(Max)
Mounting	Surface Mount
Package Weight (g)	N/A
Package Material	Plastic
Package Description	Thin Shrink Small Outline Package
Package Family Name	SO
Jedec	MO-153
Package Outline	Link to Datasheet

MSL	1
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	30
Number of Reflow Cycle	3
Reflow Temp. Source	Link to Datasheet
Lead Finish(Plating)	Au
Under Plating Material	Pd over Ni
Terminal Base Material	Cu Alloy

Packaging Suffix	118
Packaging	Tape and Reel