74ALVCH16373ZQLR Texas Instruments 16-BIT TRANSPARENT D-TYPE LATCH WITH 3-STATE OUTPUTS

label:
2025/06/6 7
74ALVCH16373ZQLR Texas Instruments 16-BIT TRANSPARENT D-TYPE LATCH WITH 3-STATE OUTPUTS


• Operates From 1.65 V to 3.6 V
• Member of the Texas Instruments Widebus™Family
• Max tpd of 3.6 ns at 3.3 V
• Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors 
• Latch-Up Performance Exceeds 250 mA Per JESD 17


CATALOG
74ALVCH16373ZQLR COUNTRY OF ORIGIN
74ALVCH16373ZQLR LIFECYCLE
74ALVCH16373ZQLR PARAMETRIC INFO
74ALVCH16373ZQLR PACKAGE INFO
74ALVCH16373ZQLR MANUFACTURING INFO
74ALVCH16373ZQLR PACKAGING INFO
74ALVCH16373ZQLR ECAD MODELS


COUNTRY OF ORIGIN
Taiwan (Province of China)


LIFECYCLE
Obsolete
Jan 07,2021


PARAMETRIC INFO
Type D-Type
Latch Mode Transparent
Bus Hold Yes
Logic Family ALVC
Process Technology CMOS
Number of Elements per Chip 2
Number of Channels per Chip 16
Number of Inputs per Chip 16
Number of Outputs per Chip 16
Number of Output Enables per Element 1
Number of Input Enables per Element 1
Number of Selection Inputs per Element 0
Output Type 3-State
Polarity Non-Inverting
Set/Reset No
Minimum Operating Supply Voltage (V) 1.65
Maximum Operating Supply Voltage (V) 3.6
Typical Operating Supply Voltage (V) 1.8|2.5|3.3
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Commercial
Maximum Propagation Delay Time @ Maximum CL (ns) 4.3@2.7V|3.6@3.3V
Absolute Propagation Delay Time (ns) 4.9
Propagation Delay Test Condition (pF) 50
Maximum High Level Output Current (mA) -24
Maximum Low Level Output Current (mA) 24
Maximum Quiescent Current (uA) 40


PACKAGE INFO
Supplier Package BGA MICROSTAR JUNIOR
Basic Package Type Ball Grid Array
Pin Count 56
Lead Shape Ball
PCB 56
Tab N/R
Pin Pitch (mm) 0.65
Package Length (mm) 7.1(Max)
Package Width (mm) 4.6(Max)
Package Height (mm) 0.65(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 7.1(Max)
Package Overall Width (mm) 4.6(Max)
Package Overall Height (mm) 1(Max)
Seated Plane Height (mm) 1(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Plastic Ball Grid Array
Package Family Name BGA
Jedec MO-285BA-2
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) SnAgCu
Under Plating Material N/A
Terminal Base Material N/A


PACKAGING INFO
Packaging Suffix R
Packaging Tape and Reel
Quantity Of Packaging 1000
Reel Diameter (in) 13
Reel Width (mm) 16.4
Tape Pitch (mm) 8
Tape Width (mm) 16
Component Orientation Q1
Packaging Document Link to Datasheet

ECAD MODELS
Продукт RFQ