74FCT245CTPGG Renesas Electronics IC TXRX NON-INVERT 5.25V 20TSSOP

label:
2025/05/16 0
74FCT245CTPGG Renesas Electronics IC TXRX NON-INVERT 5.25V 20TSSOP


• Std., A, and C grades
• Low input and output leakage ≤1µA (max.)
• CMOS power levels
• High Drive outputs (-15mA IOH, 64mA IOL)
• Meets or exceeds JEDEC standard 18 specifications


CATALOG
74FCT245CTPGG LIFECYCLE
74FCT245CTPGG PARAMETRIC INFO
74FCT245CTPGG PACKAGE INFO
74FCT245CTPGG MANUFACTURING INFO
74FCT245CTPGG PACKAGING INFO


LIFECYCLE
Obsolete
Jul 31,2023


PARAMETRIC INFO
Logic Family FCT
Logic Function Bus Transceiver
Data Flow Direction Bi-Directional
Number of Direction Control Inputs 1 Low/High
Maximum Supply Current (mA) 14
Typical Supply Current (mA) 5
Number of Elements per Chip 1
Number of Channels per Chip 8
Number of Selection Inputs per Element 0
Number of Input Enables per Element 0
Number of Output Enables per Element 1 Low
Output Type 3-State
Polarity Non-Inverting
Input Level TTL
Output Level TTL
Bus Hold No
Process Technology CMOS
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Minimum Operating Supply Voltage (V) 4.75
Maximum Operating Supply Voltage (V) 5.25
Typical Operating Supply Voltage (V) 5
Maximum High Level Output Current (mA) -15
Maximum Low Level Output Current (mA) 64
Typical Quiescent Current (uA) 10
Maximum Quiescent Current (uA) 1000
Maximum Propagation Delay Time @ Maximum CL (ns) 4.1@5V
Propagation Delay Test Condition (pF) 50
Absolute Propagation Delay Time (ns) 5.8


PACKAGE INFO
Supplier Package TSSOP
Basic Package Type Lead-Frame SMT
Pin Count 20
Lead Shape Gull-wing
PCB 20
Tab N/R
Pin Pitch (mm) 0.65
Package Length (mm) 6.5
Package Width (mm) 4.4
Package Height (mm) 1
Package Diameter (mm) N/R
Seated Plane Height (mm) 1.1
Mounting Surface Mount
Package Material Plastic
Package Description Thin Shrink Small Outline Package
Package Family Name SO
Jedec MO-153AC
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material Ag
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Tube
Quantity Of Packaging 74


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