 |
|
| • Wide supply voltage range from 2.0 to 6.0 V |
| • CMOS low power dissipation |
| • High noise immunity |
| • 8-bit serial input |
| • 8-bit serial or parallel output |
| • Storage register with 3-state outputs |
| • Shift register with direct clear |
| • Latch-up performance exceeds 100 mA per JESD 78 Class II Level B |
• Complies with JEDEC standards:
• JESD8C (2.7 V to 3.6 V)
• JESD7A (2.0 V to 6.0 V) |
• Input levels:
• For 74HC595: CMOS level
• For 74HCT595: TTL level |
• ESD protection:
• HBM JESD22-A114F exceeds 2000 V
• MM JESD22-A115-A exceeds 200 V |
| • Multiple package options |
| • Specified from -40 °C to +85 °C and from -40 °C to +125 °C |
|
| CATALOG |
| 74HC595PW,118 COUNTRY OF ORIGIN |
| 74HC595PW,118 PARAMETRIC INFO |
| 74HC595PW,118 PACKAGE INFO |
| 74HC595PW,118 MANUFACTURING INFO |
| 74HC595PW,118 PACKAGING INFO |
| 74HC595PW,118 APPLICATIONS
|
|
| COUNTRY OF ORIGIN |
| China |
| Malaysia |
| Netherlands |
| Philippines |
| Taiwan (Province of China) |
| Thailand |
|
| PARAMETRIC INFO |
| Logic Function |
Shift Register |
| Logic Family |
HC |
| Process Technology |
CMOS |
| Number of Count Input Enables |
0 |
| Number of Element Inputs |
1 |
| Number of Element Outputs |
9 |
| Number of Elements per Chip |
1 |
| Number of Selection Inputs per Element |
0 |
| Number of Stages |
8 |
| Operation Mode |
Serial to Serial/Parallel |
| Output Type |
3-State |
| Reset Type |
Asynchronous |
| Direction Type |
Uni-Directional |
| Terminal Count Output |
No |
| Triggering Type |
Positive-Edge |
| Minimum Operating Supply Voltage (V) |
2 |
| Maximum Operating Supply Voltage (V) |
6 |
| Typical Operating Supply Voltage (V) |
5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Maximum Propagation Delay Time @ Maximum CL (ns) |
175@2V|35@4.5V|30@6V |
| Absolute Propagation Delay Time (ns) |
265 |
| Propagation Delay Test Condition (pF) |
50 |
| Maximum Quiescent Current (mA) |
0.16 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Parallel Enable Input |
No |
|
| PACKAGE INFO |
| Supplier Package |
TSSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
16 |
| Lead Shape |
Gull-wing |
| PCB |
16 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
5.1(Max) |
| Package Width (mm) |
4.5(Max) |
| Package Height (mm) |
0.95(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5.1(Max) |
| Package Overall Width (mm) |
6.6(Max) |
| Package Overall Height (mm) |
1.1(Max) |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
0.06365 |
| Package Material |
Plastic |
| Package Description |
Thin Shrink Small Outline Package |
| Package Family Name |
SOP |
| Jedec |
MO-153 |
|
| MANUFACTURING INFO |
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
10 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/A |
|
| PACKAGING INFO |
| Packaging Suffix |
118 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
12 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Feed Hole Pitch (mm) |
4 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
| APPLICATIONS
|
| • Serial-to-parallel data conversion |
| • Remote control holding register |
|
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