74LVC1G02GS,132 Nexperia IC GATE NOR 1CH 2-INP 6XSON

2025/11/26 0

• Wide supply voltage range from 1.65 V to 5.5 V

• Overvoltage tolerant inputs to 5.5 V

• High noise immunity

• CMOS low power dissipation

• IOFF circuitry provides partial Power-down mode operation

• ±24 mA output drive (VCC = 3.0 V)

CATALOG

Malaysia

Logic Family	LVC
Logic Function	NOR
Number of Element Inputs	2-IN
Number of Element Outputs	1
Maximum Supply Current (mA)	100
Minimum High Level Input Voltage (V)	1.7
Number of Elements per Chip	1
Maximum Low Level Input Voltage (V)	0.8
Number of Output Enables per Element	0
Minimum High Level Output Voltage (V)	0.95
Number of Selection Inputs per Element	0
Maximum Low Level Output Voltage (V)	0.8
Output Type	Push-Pull
Maximum Input Leakage Current (uA)	1
Minimum Operating Supply Voltage (V)	1.65
Maximum Operating Supply Voltage (V)	5.5
Typical Operating Supply Voltage (V)	1.8\|2.5\|3.3\|5
Maximum High Level Output Current (mA)	-32
Maximum Low Level Output Current (mA)	32
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	125
Minimum Storage Temperature (°C)	-65
Maximum Storage Temperature (°C)	150
Maximum Propagation Delay Time @ Maximum CL (ns)	2.5(Typ)@2.7V\|2.1(Typ)@3.3V\|1.7(Typ)@5V
Absolute Propagation Delay Time (ns)	10.5
Propagation Delay Test Condition (pF)	50
Maximum Quiescent Current (uA)	4
Typical Quiescent Current (uA)	0.1

Supplier Package	XSON
Basic Package Type	Non-Lead-Frame SMT
Pin Count	6
Lead Shape	No Lead
PCB	6
Tab	N/R
Pin Pitch (mm)	0.35
Package Length (mm)	1
Package Width (mm)	1
Package Height (mm)	0.31(Max)
Package Diameter (mm)	N/R
Package Overall Length (mm)	1
Package Overall Width (mm)	1
Package Overall Height (mm)	0.35(Max)
Seated Plane Height (mm)	0.35(Max)
Mounting	Surface Mount
Package Weight (g)	N/A
Package Material	Plastic
Package Description	Plastic Extremely Thin Small Outline Package No Lead
Package Family Name	SON
Jedec	N/A
Package Outline	Link to Datasheet
Maximum PACKAGE_DIMENSION_H	0.31
Minimum PACKAGE_DIMENSION_H	N/A
Maximum PACKAGE_DIMENSION_L	1.05
Minimum PACKAGE_DIMENSION_L	0.95
Maximum PACKAGE_DIMENSION_W	1.05
Minimum PACKAGE_DIMENSION_W	0.95
Maximum Diameter	N/R
Minimum Diameter	N/R
Maximum Seated_Plane_Height	0.35
Minimum Seated_Plane_Height	N/A

MSL	1
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	30
Number of Reflow Cycle	3
Standard	N/A
Reflow Temp. Source	Link to Datasheet
Lead Finish(Plating)	N/A
Under Plating Material	NiPdAu
Terminal Base Material	Cu Alloy