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• Wide Supply Voltage Range from 1.65 to 5.5V
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• ± 24mA Output Drive at 3.3V
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• CMOS Low Power Consumption
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• IOFF Supports Partial-Power-Down Mode Operation
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• Inputs Accept Up to 5.5V
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• ESD Protection Tested per JESD 22 Exceeds 200-V Machine Model (A115) Exceeds 2000-V Human Body Model (A114) Exceeds 1000-V Charged Device Model (C101)
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• Latch-Up Exceeds 100mA per JESD 78, Class I
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• Range of Package Options
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• Direct Interface with TTL Levels
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• Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
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| CATALOG |
74LVC1G125SE-7 PARAMETRIC INFO
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74LVC1G125SE-7 PACKAGE INFO
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74LVC1G125SE-7 MANUFACTURING INFO
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74LVC1G125SE-7 PACKAGING INFO
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74LVC1G125SE-7 APPLICATIONS
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PARAMETRIC INFO
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| Process Technology |
CMOS |
| Logic Family |
LVC |
| Logic Function |
Buffer/Line Driver |
| Input Signal Type |
Single-Ended |
| Output Type |
3-State |
| Polarity |
Non-Inverting |
| Tolerant I/Os (V) |
5.5 Inputs |
| Bus Hold |
No |
| Number of Elements per Chip |
1 |
| Number of Channels per Chip |
1 |
| Number of Output Enables per Chip |
1 Low |
| Number of Input Enables per Chip |
0 |
| Number of Inputs per Chip |
1 |
| Number of Outputs per Chip |
1 |
| Minimum Operating Supply Voltage (V) |
1.65 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Typical Operating Supply Voltage (V) |
1.8|2.5|3.3|5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Maximum Propagation Delay Time @ Maximum CL (ns) |
2.5(Typ)@2.7V|2.1(Typ)@3.3V|1.7(Typ)@5V |
| Absolute Propagation Delay Time (ns) |
12 |
| Propagation Delay Test Condition (pF) |
50 |
| Maximum High Level Output Current (mA) |
-32 |
| Maximum Low Level Output Current (mA) |
32 |
| Maximum Quiescent Current (uA) |
200 |
| Typical Quiescent Current (uA) |
0.1 |
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|
PACKAGE INFO
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| Supplier Package |
SOT-353 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
5 |
| Lead Shape |
Gull-wing |
| PCB |
5 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
2.15 |
| Package Width (mm) |
1.3 |
| Package Height (mm) |
0.95 |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1 |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Small Outline Transistor |
| Package Family Name |
SOT |
| Package Outline |
Link to Datasheet |
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|
MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
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|
PACKAGING INFO
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| Packaging Suffix |
7 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Packaging Document |
Link to Datasheet |
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APPLICATIONS
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• Voltage Level Shifting
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• General Purpose Logic
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• Power Down Signal Isolation
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• Wide Array of Products Such as:PCs, Networking, Notebooks, Netbooks, PDAs Tablet Computers, E-readers Computer Peripherals, Hard Drives, CD/DVD ROMs TVs, DVDs, DVRs, Set Top Boxes Cell Phones, Personal Navigation / GPS MP3 Players, Cameras, Video Recorders
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