854-22-002-10-001101 Mill-Max CONN SPRING PISTON 2POS PCB

label:
2025/11/5 0
854-22-002-10-001101 Mill-Max CONN SPRING PISTON 2POS PCB


• Single-row spring-loaded pogo pin header, 2 positions, 0.050″ pitch.
• High durability: up to 100,000 mating cycles.
• Gold plated contacts and springs for low resistance and reliable connection.
• Wide operating temperature range (-55 °C to +125 °C).
• Through-hole mounting for vertical insertion into PCB.


CATALOG
854-22-002-10-001101 COUNTRY OF ORIGIN
854-22-002-10-001101 PARAMETRIC INFO
854-22-002-10-001101 PACKAGING INFO
854-22-002-10-001101 APPLICATIONS


COUNTRY OF ORIGIN
United States


PARAMETRIC INFO
Number of positions
2 positions (single row)
Pitch (grid)
0.050″ (1.27 mm) pitch typical for Series 854.
Mounting style
Through-hole mounting (vertical)
Initial height / stroke
Initial height: 0.350″ (8.89 mm) • Stroke: 0.055″ (1.397 mm)
Durability (mechanical cycles)
Up to 100,000 cycles at mid-stroke.
Rated voltage
100 VRMS / 150 VDC typical.
Contact resistance
Max 20 mΩ typical.
Insulation resistance
10,000 MΩ minimum.
Temperature rating
Operating -55 °C to +125 °C.
Compliance / RoHS
RoHS-compliant (RoHS, RoHS-2, RoHS-3)


PACKAGING INFO
• Package type: Through-hole header, single row, 2 positions.
• Termination style: Through-hole soldering into PCB.
• Plating / Materials: Contact piston & base made of machined copper alloy plated approx. 20 µin (0.51 µm) gold over nickel; spring made of beryllium copper with 10 µin gold plating.
• Mounting dimension & tolerances: See datasheet for length tolerances and flatness; typical length tolerance ±0.005″ for length ≤ 2″.
• Packaging / supply: Typically supplied in bulk/tray/tape depending on distributor; example listing shows bulk packaging.


APPLICATIONS
• Board-to-board interconnects where one board mates with another in stacking or modular assemblies (blind mate).
• Battery or charger interface connections requiring spring contact and reliable pressing contact.
• Test fixtures and measurement equipment where frequent mating/unmating occurs; high durability aids reliability.
• Portable instrumentation and handheld electronics requiring compact interconnects with tolerance to uneven mating surfaces.
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