|
|
• Single or dual core ARM v7-Cortex-A9 CPU with NEON SIMD and Floating Point Unit (FPU)
|
• Symmetric/Asymmetric multiprocessing (SMP/AMP) operational modes
|
• Up to 1.6GHz with 1MB L2 Cache, 32KB L1 Cache, 28nm
|
• 372-pin 17 x 17mm TFBGA, 0.8mm pitch
|
• High-speed, low latency, tightly coupled DDR3/3L/4 + ECC DRAM memory controller with advanced transaction re-ordering and prefetch engine
|
• Six multiplexed high-speed SERDES interfaces
|
• Four Gen2 x1 PCIe or one Gen2 x4, two GbE, Armada 385 two SATA or Armada 388 four SATA, one USB 2.0, two USB 3.0,one SDIO
|
• Advanced power management controller
|
• Available in iTemp
|
|
| CATALOG |
88E1512-A0-NNP2C000 COUNTRY OF ORIGIN
|
88E1512-A0-NNP2C000 PARAMETRIC INFO
|
88E1512-A0-NNP2C000 PACKAGE INFO
|
88E1512-A0-NNP2C000 MANUFACTURING INFO
|
| 88E1512-A0-NNP2C000 PACKAGING INFO |
88E1512-A0-NNP2C000 ECAD MODELS
|
|
COUNTRY OF ORIGIN
|
Taiwan (Province of China)
|
Singapore
|
|
PARAMETRIC INFO
|
| Type |
Ethernet Transceiver |
| Maximum Data Rate |
1Gbps |
| Number of Channels per Chip |
1 |
| PHY Line Side Interface |
No |
| JTAG Support |
No |
| Standard Supported |
10BASE-T/100BASE-TX/1000BASE-T |
| Typical Data Rate (Mbps) |
10/100/1000 |
| Integrated CDR |
No |
| Overhead Octet Support |
No |
| Minimum Operating Temperature (°C) |
0 |
| Maximum Operating Temperature (°C) |
70 |
| Supplier Temperature Grade |
Commercial |
| Process Technology |
CMOS |
| Maximum Storage Temperature (°C) |
125 |
| Minimum Storage Temperature (°C) |
-55 |
| Power Supply Type |
Analog|Digital |
| Typical Operating Supply Voltage (V) |
1|1.8|3.3 |
| Minimum Operating Supply Voltage (V) |
0.95|1.71|3.14 |
| Maximum Operating Supply Voltage (V) |
1.05|1.89|3.46 |
| Operating Supply Voltage (V) |
1|1.8|3.3 |
|
|
PACKAGE INFO
|
| Supplier Package |
QFN EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
56 |
| Lead Shape |
No Lead |
| PCB |
56 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
8 |
| Package Width (mm) |
8 |
| Package Height (mm) |
0.83 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
8 |
| Package Overall Width (mm) |
8 |
| Package Overall Height (mm) |
0.85 |
| Seated Plane Height (mm) |
0.85 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Quad Flat No Lead Package, Exposed Pad |
| Package Family Name |
QFN |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
| PACKAGING INFO |
| Packaging |
Tray |
| Quantity Of Packaging |
260 |
| Packaging Document |
Link to Datasheet |
|
|
| ECAD MODELS |
|
|
One-stop supplier of IC products