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CATALOG |
93LC56AT-I/OT COUNTRY OF ORIGIN
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93LC56AT-I/OT PARAMETRIC INFO
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93LC56AT-I/OT PACKAGE INFO
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93LC56AT-I/OT MANUFACTURING INFO
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93LC56AT-I/OT PACKAGING INFO
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93LC56AT-I/OT ECAD MODELS
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COUNTRY OF ORIGIN
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Thailand |
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PARAMETRIC INFO
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Density (bit) |
2K |
Interface Type |
Serial-Microwire |
Maximum Operating Frequency (MHz) |
2 |
Maximum Access Time (ns) |
250 |
Typical Operating Supply Voltage (V) |
3.3|5 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Supplier Temperature Grade |
Industrial |
Maximum Cycle Time (s) |
15m |
Programmability |
Yes |
I/O Mode |
Serial |
Density in Bits (bit) |
2048 |
Maximum Operating Current (mA) |
2 |
Hardware Data Protection |
Yes |
Organization |
256x8 |
Data Retention (Year) |
200(Min) |
Minimum Operating Supply Voltage (V) |
2.5 |
Maximum Operating Supply Voltage (V) |
5.5 |
Minimum Storage Temperature (°C) |
-65 |
Number of Bits per Word (bit) |
8 |
Maximum Storage Temperature (°C) |
150 |
Address Bus Width (bit) |
8 |
Process Technology |
CMOS |
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PACKAGE INFO
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Supplier Package |
SOT-23 |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
6 |
Lead Shape |
Gull-wing |
PCB |
6 |
Tab |
N/R |
Package Length (mm) |
2.9 |
Package Width (mm) |
1.6 |
Package Height (mm) |
1.15 |
Package Diameter (mm) |
N/R |
Mounting |
Surface Mount |
Package Description |
Small Outline Transistor |
Package Family Name |
SOT |
Jedec |
MO-178AB |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
20 to 40 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020C |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Matte Sn annealed |
Under Plating Material |
N/A |
Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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Packaging Suffix |
T |
Packaging |
Tape and Reel |
Quantity Of Packaging |
3000 |
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ECAD MODELS
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