93LC56AT-I/OT Microchip Technology IC EEPROM 2K SPI 2MHZ SOT23-6

label:
2024/01/12 298



CATALOG
93LC56AT-I/OT COUNTRY OF ORIGIN
93LC56AT-I/OT PARAMETRIC INFO
93LC56AT-I/OT PACKAGE INFO
93LC56AT-I/OT MANUFACTURING INFO
93LC56AT-I/OT PACKAGING INFO
93LC56AT-I/OT ECAD MODELS


COUNTRY OF ORIGIN
Thailand


PARAMETRIC INFO
Density (bit) 2K
Interface Type Serial-Microwire
Maximum Operating Frequency (MHz) 2
Maximum Access Time (ns) 250
Typical Operating Supply Voltage (V) 3.3|5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Maximum Cycle Time (s) 15m
Programmability Yes
I/O Mode Serial
Density in Bits (bit) 2048
Maximum Operating Current (mA) 2
Hardware Data Protection Yes
Organization 256x8
Data Retention (Year) 200(Min)
Minimum Operating Supply Voltage (V) 2.5
Maximum Operating Supply Voltage (V) 5.5
Minimum Storage Temperature (°C) -65
Number of Bits per Word (bit) 8
Maximum Storage Temperature (°C) 150
Address Bus Width (bit) 8
Process Technology CMOS


PACKAGE INFO
Supplier Package SOT-23
Basic Package Type Lead-Frame SMT
Pin Count 6
Lead Shape Gull-wing
PCB 6
Tab N/R
Package Length (mm) 2.9
Package Width (mm) 1.6
Package Height (mm) 1.15
Package Diameter (mm) N/R
Mounting Surface Mount
Package Description Small Outline Transistor
Package Family Name SOT
Jedec MO-178AB
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 20 to 40
Number of Reflow Cycle 3
Standard J-STD-020C
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Suffix T
Packaging Tape and Reel
Quantity Of Packaging 3000


ECAD MODELS


Продукт RFQ