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▪ AEC-Q100 automotive qualified
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▪ Unipolar switch points
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▪ Resistant to physical stress
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▪ Superior temperature stability
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▪ Output short-circuit protection
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▪ Operation from unregulated supply
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▪ Reverse-battery protection
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▪ Solid-state reliability
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▪ Small package sizes
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| CATALOG |
A1120EUA-T COUNTRY OF ORIGIN
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A1120EUA-T PARAMETRIC INFO
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A1120EUA-T PACKAGE INFO
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A1120EUA-T MANUFACTURING INFO
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A1120EUA-T PACKAGING INFO
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A1120EUA-T ECAD MODELS
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COUNTRY OF ORIGIN
|
Philippines
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|
PARAMETRIC INFO
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| Magnetic Type |
Unipolar |
| Minimum Magnetic Sensor Release Point (Gs) |
5 |
| Typical Magnetic Sensor Hysteresis (Gs) |
10 |
| Maximum Magnetic Sensor Operating Point (Gs) |
50 |
| Minimum Operating Supply Voltage (V) |
3 |
| Typical Operating Supply Voltage (V) |
3.3|5|9|12|15|18 |
| Maximum Operating Supply Voltage (V) |
24 |
| Maximum Supply Current (uA) |
4000 |
| Process Technology |
BiCMOS |
| Maximum Output Current (mA) |
25 |
| Response Point List |
(5,0.5),(50,24) |
| Maximum Rise Time (ns) |
2000 |
| Maximum Fall Time (ns) |
2000 |
| Topology |
v(1,1) |
| Output Type |
Analog(Voltage) |
| Maximum Output Voltage (V) |
24 |
| Minimum Output Voltage (V) |
0.5 |
| Linearity |
No |
| Typical Output Fall Time (us) |
0.1 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Automotive |
| Output Driver |
Open Drain |
| Operating Supply Voltage (V) |
3.3|5|9|12|15|18 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
170 |
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PACKAGE INFO
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| Supplier Package |
Ultra Mini SIP |
| Basic Package Type |
Through Hole |
| Pin Count |
3 |
| Lead Shape |
Through Hole |
| PCB |
3 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
4.09 |
| Package Width (mm) |
1.52 |
| Package Height (mm) |
3.02 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
4.09 |
| Package Overall Width (mm) |
1.52 |
| Package Overall Height (mm) |
4.12(Max) |
| Seated Plane Height (mm) |
4.12(Max) |
| Mounting |
Through Hole |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Ultra Mini Single In Line Package |
| Package Family Name |
SIP |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
N/R |
| Maximum Reflow Temperature (°C) |
N/R |
| Reflow Solder Time (Sec) |
N/R |
| Maximum Wave Temperature (°C) |
245 to 270 |
| Wave Solder Time (Sec) |
10 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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| Packaging |
Bulk |
| Quantity Of Packaging |
500 |
| Packaging Document |
Link to Datasheet |
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| ECAD MODELS |
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