A3P250-VQG100I Microchip Technology IC FPGA 68 I/O 100VQFP

label:
2024/03/1 316



CATALOG
A3P250-VQG100I COUNTRY OF ORIGIN
A3P250-VQG100I PARAMETRIC INFO
A3P250-VQG100I PACKAGE INFO
A3P250-VQG100I MANUFACTURING INFO
A3P250-VQG100I PACKAGING INFO
A3P250-VQG100I ECAD MODELS


COUNTRY OF ORIGIN
Taiwan (Province of China)
Thailand
China
Philippines
Malaysia
United States of America


PARAMETRIC INFO
Device Logic Gates 250000
Device System Gates 250000
Maximum Number of User I/Os 68
Number of I/O Banks 4
Device Number of DLLs/PLLs 1
Number of Inter Dielectric Layers 7
Maximum LVDS Data Rate (Mbps) 700
Tradename ProASIC
Number of Registers 6144
Maximum Differential I/O Pairs 13
Maximum I/O Performance 700Mbps
RAM Bits (Kbit) 36
Total Number of Block RAM 8
Program Memory Type Flash
Series name ProASIC®3
Process Technology 130nm
Speed Grade STD
Differential I/O Standards Supported LVDS|LVPECL|B-LVDS|M-LVDS
Single-Ended I/O Standards Supported LVTTL|LVCMOS
JTAG Support (-) yes
Maximum Supply Current (mA) 30
Copy Protection no
Programmability yes
In-System Programmability yes
Reprogrammability Support yes
Maximum Internal Frequency (MHz) 231
Number of Global Clocks 18
Maximum Operating Supply Voltage (V) 1.575
I/O Voltage (V) 1.5|1.8|2.5|3.3
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 100
Temperature Flag Opr
Supplier Temperature Rating Industrial
Digital Control Impedance no
Minimum Operating Supply Voltage (V) 1.425
Typical Operating Supply Voltage (V) 1.5
Tolerant Configuration Interface Voltage (V) 5
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier packaging VQFP
Basic package type Lead-Frame SMT
Number of pins 100
Pin shape Gull-wing
PCB 100
ears N/R
Pin spacing (mm) 0.5
Package length (mm) 14
Package width (mm) 14
Package height (mm) 1
Package diameter (mm) N/R
Mounting surface height (mm) 1.2(Max)
Install Surface Mount
Packaging materials Plastic
package instruction Very Thin Quad Flat Package
Package series name QFP
JEDEC MS-026AED
Package outline Link to datasheet


MANUFACTURING INFO
MSL 3
Maximum reflow temperature (°C) 260
Reflow soldering time (seconds) 20 to 40
Number of reflow cycles 3
standard J-STD-020C
Reflow temperature source Link to datasheet
Maximum wave soldering temperature (°C) N/R
Wave soldering time (seconds) N/R
Lead Finish(Plating) Matte Sn annealed|Au
Plating materials N/A|Pd over Ni
Terminal Base Material not applicable


PACKAGING INFO
Package Tray
Packing quantity 1
packaging type file Link to datasheet


ECAD MODELS



Продукт RFQ