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• Low in height; suitable for thin equipment
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• Glass sealed package assures high reliability and high temperature operation
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• Tight tolerance and stability available
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• IR reflow capable
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• Low cost version of ABM8 crystal
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| CATALOG |
ABM8G-27.000MHZ-18-D2Y-T COUNTRY OF ORIGIN
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ABM8G-27.000MHZ-18-D2Y-T PARAMETRIC INFO
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ABM8G-27.000MHZ-18-D2Y-T PACKAGE INFO
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ABM8G-27.000MHZ-18-D2Y-T MANUFACTURING INFO
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ABM8G-27.000MHZ-18-D2Y-T PACKAGING INFO
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ABM8G-27.000MHZ-18-D2Y-T ECAD MODELS
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ABM8G-27.000MHZ-18-D2Y-T APPLICATIONS
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|
COUNTRY OF ORIGIN
|
China
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|
PARAMETRIC INFO
|
| Typical Drive Level (uW) |
10 |
| Type |
Crystal |
| Standard Frequency (MHz) |
27 |
| Frequency Tolerance (ppm) |
±20 |
| Frequency Stability (ppm) |
±30 |
| Load Capacitance (pF) |
18 |
| Mode of Oscillation |
Fundamental |
| Series Resistance (Ohm) |
60 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Minimum Storage Temperature (°C) |
-40 |
| Maximum Storage Temperature (°C) |
85 |
| Frequency Aging (ppm/Year) |
±3 (1st) |
|
|
PACKAGE INFO
|
| Supplier Package |
Ultra Mini-CSMD |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
4 |
| Lead Shape |
No Lead |
| PCB |
4 |
| Tab |
N/R |
| Pin Pitch (mm) |
N/A |
| Package Length (mm) |
3.2 |
| Package Width (mm) |
2.5 |
| Package Height (mm) |
1(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.2 |
| Package Overall Width (mm) |
2.5 |
| Package Overall Height (mm) |
1(Max) |
| Seated Plane Height (mm) |
1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Ceramic |
| Package Description |
Ultra Miniature Ceramic Surface Mount Device |
| Package Family Name |
SMD |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
N/R |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
10 |
| Number of Reflow Cycle |
2 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
N/A |
| Terminal Base Material |
Ceramics |
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|
PACKAGING INFO
|
| Packaging Suffix |
-T |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1000 |
|
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ECAD MODELS
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| APPLICATIONS |
| • High density applications. |
| • Modems, communication and test equipment. |
| • PMCIA, wireless applications |
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