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• 50 Ω Input/Output
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• No external matching required
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• Low Insertion Loss, High Interference Rejection
- Enables concurrent use of other 2.5 GHz Bands
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• Subminiature Size
- 1.1 x 1.4 mm Footprint
- 0.80 mm Max Height
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• High Power Rating
- +27 dBm Abs Max Input Power
|
| • Operating Temperature Range
- –40 °C to +85 °C
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| • Environmental
- RoHS 6 Compliant
- Halogen free
- TBBPA Free |
|
| CATALOG |
| ACFF-1024-TR1 COUNTRY OF ORIGIN |
ACFF-1024-TR1 PARAMETRIC INFO
|
ACFF-1024-TR1 PACKAGE INFO
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ACFF-1024-TR1 MANUFACTURING INFO
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ACFF-1024-TR1 PACKAGING INFO
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ACFF-1024-TR1 APPLICATIONS
|
|
| COUNTRY OF ORIGIN |
| Malaysia |
| China |
|
PARAMETRIC INFO
|
| Load Impedance |
50Ohm |
| Maximum Insertion Loss (dB) |
3 |
| Pass Band Ripple (dB) |
1.4(Typ) |
| Maximum Operating Temperature (°C) |
85 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Storage Temperature (°C) |
125 |
| Minimum Storage Temperature (°C) |
-40 |
|
|
PACKAGE INFO
|
| Mounting |
Surface Mount |
| Number of Terminals |
5 |
| Product Length (mm) |
1.4 |
| Product Depth (mm) |
1.1 |
| Product Height (mm) |
0.8 |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
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|
PACKAGING INFO
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APPLICATIONS
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• 802.11 b/g/n WLAN Access Point and Small Cell BTS with
embedded WLAN functionality
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| |
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