|
|
• Current transfer ratio (CTR): 50% (minimum) at IF = 5 mA, VCC = 5V
|
• High input-output isolation voltage (VISO): 3750VRMS
|
• Non-saturated response time (tr): 2 μs (typical) at VCC = 10V, IC = 2 mA, RL= 100Ω
|
| • SO package
|
| • CMR: 10 kV/μs (typical) |
| • Safety and regulatory approvals– cUL– IEC/EN/DIN EN 60747-5-5 |
| • Available options– CTR Ranks 0, A, B, C, and D |
|
| CATALOG |
| ACPL-217-500E COUNTRY OF ORIGIN |
ACPL-217-500E PARAMETRIC INFO
|
ACPL-217-500E PACKAGE INFO
|
ACPL-217-500E MANUFACTURING INFO
|
ACPL-217-500E PACKAGING INFO
|
ACPL-217-500E EACD MODELS
|
| ACPL-217-500E APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| China |
|
PARAMETRIC INFO
|
| Input Type |
DC |
| Minimum Common Mode Rejection (kV/us) |
10(Typ) |
| Common Mode Voltage (V) |
1500 |
| Output Type |
DC |
| Output Device |
Transistor |
| standard |
cUL|DIN|EN|IEC|UL |
| Number of Channels per Chip |
1 |
| Typical Forward Voltage (V) |
1.2 |
| Maximum Forward Voltage (V) |
1.4 |
| Maximum Forward Current (mA) |
50 |
| Maximum Collector Current (mA) |
50 |
| Maximum Reverse Voltage (V) |
6 |
| Maximum Collector-Emitter Voltage (V) |
80 |
| Maximum Collector-Emitter Saturation Voltage (mV) |
400 |
| Minimum Isolation Voltage (Vrms) |
3750 |
| Maximum Power Dissipation (mW) |
200 |
| Minimum Current Transfer Ratio (%) |
50 |
| Maximum Current Transfer Ratio (%) |
600 |
| Current Transfer Ratio Test Current (mA) |
5 |
| Typical Rise Time (us) |
2 |
| Typical Fall Time (us) |
3 |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
110 |
| Maximum Storage Temperature (°C) |
125 |
| Minimum Storage Temperature (°C) |
-55 |
|
|
PACKAGE INFO
|
| Supplier packaging |
SO |
| Basic package type |
Lead-Frame SMT |
| Number of pins |
4 |
| Pin shape |
Gull-wing |
| PCB |
4 |
| ears |
N/R |
| Pin spacing (mm) |
1.27 |
| Package length (mm) |
2.6 |
| Package width (mm) |
4.4 |
| Package height (mm) |
2 |
| Package diameter (mm) |
N/R |
| Mounting surface height (mm) |
2.12 |
| Install |
Surface Mount |
| Package weight (g) |
not applicable |
| Packaging materials |
Plastic |
| package instruction |
Small Outline IC |
| Package series name |
SO |
| JEDEC |
not applicable |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum reflow temperature (°C) |
260 |
| Reflow soldering time (seconds) |
10 |
| Number of reflow cycles |
not applicable |
| standard |
not applicable |
| Reflow temperature source |
Link to datasheet |
| Maximum wave soldering temperature (°C) |
N/R |
| Wave soldering time (seconds) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Plating materials |
not applicable |
| Terminal Base Material |
Alloy 194 |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Package |
Tape and reel packaging |
| Packing quantity |
3000 |
| packaging type file |
Link to datasheet |
|
|
ECAD MODELS
|
|
|
| APPLICATIONS |
| • I/O Interface for programmable controllers, computers |
| • Sequence controllers |
| • System appliances, measuring instruments |
| • Signal transmission between circuits of different potentials and impedances |
| |
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