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• Low-noise analog signal path
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• Device bandwidth is set via the new FILTER pin
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• 5 µs output rise time in response to step input current
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| • 80 kHz bandwidth |
| • Total output error 1.5% at TA= 25°C |
| • Small footprint, low-profile SOIC-8 package |
| • 1.2 mΩ internal conductor resistance |
| • 2.4 kVRMS minimum isolation voltage from pins 1-4 to pins 5-8 |
| • 5.0 V, single supply operation |
| • 66 to 185 mV/A output sensitivity |
| • Output voltage proportional to AC or DC currents |
| • Factory-trimmed for accuracy |
| • Extremely stable output offset voltage |
| • Nearly zero magnetic hysteresis |
| • Ratiometric output from supply voltage |
| |
| CATALOG |
| ACS712ELCTR-05B-T COUNTRY OF ORIGIN |
ACS712ELCTR-05B-T PARAMETRIC INFO
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ACS712ELCTR-05B-T PACKAGE INFO
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ACS712ELCTR-05B-T MANUFACTURING INFO
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ACS712ELCTR-05B-T PACKAGING INFO
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ACS712ELCTR-05B-T EACD MODELS
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|
| COUNTRY OF ORIGIN |
| Malaysia |
|
PARAMETRIC INFO
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| Type |
Open Loop |
| Typical RMS Primary Current (A) |
±5 |
| Sensing Current Type |
AC|DC |
| Accuracy (%) |
±1.5 |
| Typical Response Time (us) |
3.5 |
| Sensitivity (mV/A) |
185 |
| Operating Frequency (kHz) |
80 |
| Maximum Output Voltage (V) |
8 |
| Minimum Operating Supply Voltage (V) |
4.5 |
| Process Technology |
BiCMOS |
| Typical Operating Supply Voltage (V) |
5 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Module/IC Classification |
IC |
| Maximum Storage Temperature (°C) |
170 |
| Minimum Storage Temperature (°C) |
-65 |
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|
PACKAGE INFO
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| Supplier Package |
SOIC N |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
4.9 |
| Package Width (mm) |
3.9 |
| Package Height (mm) |
1.5(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC Narrow Body |
| Package Family Name |
SO |
| Jedec |
MS-012AA |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
2 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
20 to 40 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020C |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2000 |
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ECAD MODELS
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