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• Patented integrated digital temperature compensation circuitry allows for near closed loop accuracy over temperature in an open loop sensor
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• UL60950-1 (ed. 2) certified□ Dielectric Strength Voltage = 2.4 kVrms□ Basic Isolation Working Voltage = 420 Vpk/297 Vrms
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• Industry-leading noise performance with greatly improved bandwidth through proprietary amplifier and filter design techniques
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• Pin-selectable band width: 80 kHz for high bandwidth applications or 20 kHz for low noise performance
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• 0.65 mΩ primary conductor resistance for low power loss and high inrush current withstand capability |
• Small footprint, low-profile SOIC8 package suitable for space-constrained applications |
• Integrated shield virtually eliminates capacitive coupling from current conductor to die, greatly suppressing output noise due to high dv/dt transients |
• 3 to 3.6 V, single supply operation |
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CATALOG |
ACS722LLCTR-10AB-T COUNTRY OF ORIGIN |
ACS722LLCTR-10AB-T PARAMETRIC INFO
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ACS722LLCTR-10AB-T PACKAGE INFO
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ACS722LLCTR-10AB-T MANUFACTURING INFO
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ACS722LLCTR-10AB-T PACKAGING INFO
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COUNTRY OF ORIGIN |
Malaysia |
Philippines |
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PARAMETRIC INFO
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type |
Open Loop |
Sensing Current Type |
AC|DC |
Accuracy (%) |
±3 |
Typical Response Time (us) |
22.5 |
Sensitivity (mV/A) |
132 |
Operating Frequency (kHz) |
80 |
Maximum Output Voltage (V) |
25 |
Maximum Isolation Voltage |
2400Vrms |
Primary Current Measuring Range (A) |
±10 |
Measuring Principle |
Hall Effect |
Minimum Operating Supply Voltage (V) |
3 |
Process Technology |
BiCMOS |
Typical Operating Supply Voltage (V) |
3.3 |
Maximum Operating Supply Voltage (V) |
3.6 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
150 |
Module/IC Classification |
IC |
Maximum Storage Temperature (°C) |
165 |
Minimum Storage Temperature (°C) |
-65 |
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PACKAGE INFO
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Supplier packaging |
SOIC N |
Basic package type |
Lead-Frame SMT |
Number of pins |
8 |
Pin shape |
Gull-wing |
PCB |
8 |
ears |
N/R |
Pin spacing (mm) |
1.27 |
Package length (mm) |
4.9 |
Package width (mm) |
3.9 |
Package height (mm) |
1.5(Max) |
Package diameter (mm) |
N/R |
Mounting surface height (mm) |
1.75(Max) |
Install |
Surface Mount |
Packaging materials |
Plastic |
package instruction |
Small Outline IC Narrow Body |
Package series name |
SO |
JEDEC |
MS-012AA |
Package outline |
Link to datasheet |
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MANUFACTURING INFO
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MSL |
2 |
Maximum reflow temperature (°C) |
260 |
Reflow soldering time (seconds) |
20 to 40 |
Number of reflow cycles |
3 |
standard |
J-STD-020C |
Reflow temperature source |
Link to datasheet |
Maximum wave soldering temperature (°C) |
N/R |
Wave soldering time (seconds) |
N/R |
Wave soldering temperature source |
Link to datasheet |
Lead Finish(Plating) |
Matte Sn annealed |
Plating materials |
not applicable |
Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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Package |
Tape and reel packaging |
Packing quantity |
3000 |
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