ACS722LLCTR-10AB-T Allegro MicroSystems SENSOR CURRENT HALL 10A AC/DC

label:
2024/03/7 282



• Patented integrated digital temperature compensation circuitry allows for near closed loop accuracy over temperature in an open loop sensor
• UL60950-1 (ed. 2) certified□ Dielectric Strength Voltage = 2.4 kVrms□ Basic Isolation Working Voltage = 420 Vpk/297 Vrms
• Industry-leading noise performance with greatly improved bandwidth through proprietary amplifier and filter design techniques
• Pin-selectable band width: 80 kHz for high bandwidth applications or 20 kHz for low noise performance
• 0.65 mΩ primary conductor resistance for low power loss and high inrush current withstand capability
• Small footprint, low-profile SOIC8 package suitable for space-constrained applications
• Integrated shield virtually eliminates capacitive coupling from current conductor to die, greatly suppressing output noise due to high dv/dt transients
• 3 to 3.6 V, single supply operation


CATALOG
ACS722LLCTR-10AB-T COUNTRY OF ORIGIN
ACS722LLCTR-10AB-T PARAMETRIC INFO
ACS722LLCTR-10AB-T PACKAGE INFO
ACS722LLCTR-10AB-T MANUFACTURING INFO
ACS722LLCTR-10AB-T PACKAGING INFO


COUNTRY OF ORIGIN
Malaysia
Philippines


PARAMETRIC INFO
type Open Loop
Sensing Current Type AC|DC
Accuracy (%) ±3
Typical Response Time (us) 22.5
Sensitivity (mV/A) 132
Operating Frequency (kHz) 80
Maximum Output Voltage (V) 25
Maximum Isolation Voltage 2400Vrms
Primary Current Measuring Range (A) ±10
Measuring Principle Hall Effect
Minimum Operating Supply Voltage (V) 3
Process Technology BiCMOS
Typical Operating Supply Voltage (V) 3.3
Maximum Operating Supply Voltage (V) 3.6
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 150
Module/IC Classification IC
Maximum Storage Temperature (°C) 165
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier packaging SOIC N
Basic package type Lead-Frame SMT
Number of pins 8
Pin shape Gull-wing
PCB 8
ears N/R
Pin spacing (mm) 1.27
Package length (mm) 4.9
Package width (mm) 3.9
Package height (mm) 1.5(Max)
Package diameter (mm) N/R
Mounting surface height (mm) 1.75(Max)
Install Surface Mount
Packaging materials Plastic
package instruction Small Outline IC Narrow Body
Package series name SO
JEDEC MS-012AA
Package outline Link to datasheet


MANUFACTURING INFO
MSL 2
Maximum reflow temperature (°C) 260
Reflow soldering time (seconds) 20 to 40
Number of reflow cycles 3
standard J-STD-020C
Reflow temperature source Link to datasheet
Maximum wave soldering temperature (°C) N/R
Wave soldering time (seconds) N/R
Wave soldering temperature source Link to datasheet
Lead Finish(Plating) Matte Sn annealed
Plating materials not applicable
Terminal Base Material Cu Alloy


PACKAGING INFO
Package Tape and reel packaging
Packing quantity 3000
Продукт RFQ